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Koh Young

2014-11-25T10

SemiconductorKoh Young 2014-11-25T10 family
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2014-11-25T10 — web.archive.org
Fig. 012014-11-25T10web.archive.org[1]

What is it?

The sources identify Koh Young Prime under Semiconductor Solutions and describe it as a pre-reflow bump inspection product. Listed features include 4-way projection to eliminate shadow problems, easy and intelligent programming, monitoring bumps based on 3D profilometry, metrology for volume, area, height, and diameter, and high accuracy and repeatability below 1 μm.

What can it run?

Process applications and technology nodes documented for this tool.

  • Pre-reflow bump inspection
  • Bump monitoring
  • Metrology

Why won't it start?

Documented failure modes, common issues, and field considerations.

  • Shadow problems are mentioned as being eliminated by 4-way projection.

What do the numbers mean?

Performance1

Accuracy and repeatability
High accuracy and repeatability < 1μm[1]
Accurate?

Dimensions & facilities1

Metrology capability
Volume, area, height, diameter[1]
Accurate?

Configuration & options5

Product type
Pre-reflow bump inspection[1]
Accurate?
Projection method
4-way projection[1]
Accurate?
Programming
Easy and intelligent programming[1]
Accurate?
Inspection basis
3D profilometry-based bump monitoring/inspection[1]
Accurate?
Defect types
Excessive/insufficient, bridging, offset, missing bumps[1]
Accurate?
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the 2014-11-25T10 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2014-11-25T10 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 2014-11-25T10 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 2014-11-25T10 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • The process node or technology generation of the 2014-11-25T10 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 2014-11-25T10 are on record.

    Answerable by: an OEM parts catalog or a service engineer

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]web.archive.org — web.archive.orgweb.archive.org
  3. [3]&#8211; Semiconductor Solutions — web.archive.orgweb.archive.org
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Last updated Jul 29, 2026.