Waferpedia

MRSI-HVM1 is a high-volume manufacturing flip-chip die bonder with 1 micron accuracy.

The Nikon F-mount is a bayonet lens mount introduced in 1959 for Nikon 35mm single-lens reflex cameras, with a 44mm throat and 46.5mm flange focal distance.

ASM XP8 is a registered trademark in ASM's product portfolio.

The Agilent 11729C Carrier Noise Test Set is an integral part of a phase noise measurement system, capable of up-converting, down-converting, and phase/frequency demodulation.

The Tegal 901G is a diode plasma etcher specially configured for GaAs processing and used for etching high-performance devices on gallium arsenide substrates.

The Electroglas EG 6000 e is a wafer prober used in semiconductor test and probe applications.

Tokyo Electron Clean Track Act 8 is a DUV clean track system for 8-inch wafers.

The Panasonic Lumix DMC-L10 is a Four Thirds DSLR camera introduced in 2007 that was the first Panasonic camera to feature Face Recognition technology.

The Buehler Isomet 4000 is a precision linear sectioning saw.

The Signatone S-96MW is a micropositioner.

The Therma-Wave 1250 is a semiconductor wafer inspection system associated with Therma-Wave's wafer inspection activities.

The ESPEC 212M is an environmental test chamber model documented in two user manuals on MetrologyManuals.

The Wyko HD8000 is a non-contact optical profiler for magnetic thin-film heads that measures pole-tip recession or ABS flatness in less than 3 seconds.

The Eaton Wright 9395 Work is a work bench.

The Hitachi S 9200 is a scanning electron microscope (SEM) used for critical dimension (CD) measurements and wafer inspection, designed for 8-inch wafer processing.

The Keysight 33250A (formerly Agilent 33250A) is an 80 MHz function/arbitrary waveform generator with 12-bit, 200 MSa/s arbitrary waveform capability and 64K-point memory depth.

The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.

The CEE Apogee 300 Bake Plate is a semiconductor wafer bake plate for up to 300mm wafers with recipe-controlled thermal processing and DataStream™ logging.

Leica KMR3 is a glass knifemaker used for trimming and rough cutting specimens.

The MKS 647 B Multi-Gas Controller is an MKS tool identified by the model designation 647 B Multi-Gas Controller.

The FEI Nova 600i (also called Nova NanoLab 600i) is a DualBeam system combining a field emission scanning electron microscope (FESEM) with a gallium focused ion beam (Ga FIB) for nanoscale prototyping, machining, characterization, and analysis of structures below 100 nm.

The Leica DM2700 M is an upright materials microscope with universal white light LED illumination designed for routine inspection tasks in metallography, earth science, forensic investigation, and materials quality control and research.

The Lam Research TCP 9400 ICP is an inductively coupled plasma etcher from Lam Research.

The OAI 306 is a handheld UV power meter (radiometer) made by Optical Associates Inc. for measuring ultraviolet light intensity in real time.

The Zeiss LSM 880 is a laser scanning confocal microscope.

The Semitool 270 S L SRD is an automated spin rinse dryer used in semiconductor wafer processing.

The Tokyo Electron A 8 S ZA is a PoCl3 furnace with an EPROM based control system.

The ZEISS Axioscope 5 is a smart upright microscope designed for biomedical routine and research, featuring automatic digital documentation with a Snap button and support for multiple contrast techniques.

The South Bay Technology D500i is a dimpler used for dimple grinding samples for transmission electron microscopy (TEM).

The Wyko SP3200 is a gauge-capable advanced packaging profiling system for in-line process monitoring of flip-chip packaging.

The Balzers Pfeiffer TPG 300 Pressure Controller is a pressure controller that includes an IKR 020 gauge.

The K&S 4524 D is a Digital Series manual wire bonder.

The Tel Unity M 8555 DDD is an etcher from Tokyo Electron.

The Pfeiffer HiPace 800 + TC 400 is a turbo pump with a TC 400 controller.

The Tektronix 4012 is a text-and-graphics computer terminal in the Tektronix 4010 series that added lower case characters to the base 4010 model.

The DEK 288 is a screen printer for printed circuit boards, supporting board sizes up to 510x510 mm with vision alignment accuracy of 25 µm.

The Axcelis NV GSD A 80 Ion is an ion implanter.

The YES 12-2P-CP is a manual-load high-temperature cure oven for MEMS and semiconductor process applications.

The Brooks 4900 Series Adapter is a 125 amp A to S conversion adapter. The Brooks 4900 Series Adapter is molded from fiberglass-reinforced polyester. The Brooks 4900 Series Adapter is rated NEMA 3R for indoor and outdoor use.

The Zeiss Contura X 700 / X 1000 is a measuring machine manufactured by Zeiss.

The Genmark 2234 MB 3320 Robot is a robot manufactured by Genmark.

The ESEC ESEC_2100HS is an automatic epoxy die bonder. The ESEC ESEC_2100HS appears in the category of semiconductor assembly die bonders.

The Filmetrics R50 – 200 – 4PP is a metrology tool configured by default for metallic layers and sample thicknesses of 525 µm ± 25 µm.

The Samsung Galaxy S5 is an Android smartphone announced in February 2014 and released in April 2014, featuring a 5.1-inch Super AMOLED display, a 16 MP rear camera, and IP67 dust/water resistance.

The Semitool ST 260 SRD is a spin rinse dryer designed for processing 2-inch wafers.

The YXLON FF20 CT is a high-precision industrial computed tomography system for electronic applications and small-scale electronics components.

The Tektronix 4015 is a Tektronix 4014 with the APL character set card from the 4013.

The Despatch LCD1-16NV-3 is an oven for polymer curing with nitrogen circulation, a HEPA filter, and temperature monitoring capability.

The Filmetrics F70 measures the thickness of glass and plastic materials up to 13 mm thick.

The Brooks / PRI DBM 2706 is an atmospheric wafer handling robot with a dual-arm configuration.

The Rasco SO 2000 Handler is a dual-temp tube-to-tube handler for SSOP 8 and 16 packages with 4 sites.

The ASM MS 896 is a mapping die sorter.

The Disco 3220 is a dicing saw used for wafer singulation in semiconductor backend processing.

The ULVAC UNECS-2000 is a spectroscopic ellipsometer used to measure refractive index and thin-film thickness.