Waferpedia

The Agilent 11729C Carrier Noise Test Set is an integral part of a phase noise measurement system, capable of up-converting, down-converting, and phase/frequency demodulation.

The Applied Materials 0010-13627 is a high efficiency RF match designed for semiconductor equipment.

The EVG 301 is a semi-automated single wafer cleaning system for R&D, featuring megasonic cleaning, spinner rotation up to 3000 rpm, and optional pre-bonding and IR-inspection modules.

The Denton Vacuum EE-4 is an electron beam deposition tool with a 6-position hearth, a dual chamber design, automated pump-down/venting, and capacity for multiple wafer sizes.

The Disco DAD641 is an automatic dicing saw used for wafer dicing operations.

The SPTS CET25 is a 25-wafer batch process module for HF vapor release etch for MEMS.

The JEOL JLC-5AH is an amino acid analyzer, first produced in 1968 as the world's first such instrument.

The SPTS MVD100E is a Molecular Vapor Deposition system designated for R&D or pilot manufacturing.

The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.

The PR Hoffman 94T is an insert carrier for double-sided planetary lapping and polishing machines, supporting 3-inch (76 mm) wafers.

The Disco DAD3241 is a high-productivity automatic dicing saw that supports large workpieces up to Φ8”.

The FEI Nova 600i (also called Nova NanoLab 600i) is a DualBeam system combining a field emission scanning electron microscope (FESEM) with a gallium focused ion beam (Ga FIB) for nanoscale prototyping, machining, characterization, and analysis of structures below 100 nm.

The Leica DM2700 M is an upright materials microscope with universal white light LED illumination designed for routine inspection tasks in metallography, earth science, forensic investigation, and materials quality control and research.

The Tegal 4200 SE is an advanced cluster platform for 3D IC and MEMS applications.

The Zeiss LSM 880 is a laser scanning confocal microscope.

The KLA .498 PSL Wafer is a NIST traceable reference wafer.

The ZEISS Axioscope 5 is a smart upright microscope designed for biomedical routine and research, featuring automatic digital documentation with a Snap button and support for multiple contrast techniques.

The SCIEX API 3000 is a triple quadrupole LC/MS/MS mass spectrometer used for analytical applications such as protein and peptide analysis, small molecule drug metabolism studies, and pharmacokinetic screening.

The Bruker Contour R1 is a 3D optical metrology system used for non-contact surface characterization.

The Strasbaugh 6 AI-DC 6 is a polisher.

The Disco DFL7340 is a stealth dicing system used for silicon wafer dicing.

The NanoSpec Film Thickness Measurement System is a metrology tool used for measuring the thickness of thin films such as silicon dioxide and silicon nitride.

The DEK 288 is a screen printer for printed circuit boards, supporting board sizes up to 510x510 mm with vision alignment accuracy of 25 µm.

The Oxford 100 Plus Nitride is a nitride deposition system made by Oxford.

The Samsung Galaxy S5 is an Android smartphone announced in February 2014 and released in April 2014, featuring a 5.1-inch Super AMOLED display, a 16 MP rear camera, and IP67 dust/water resistance.

The Filmetrics F50-UV is a thin-film metrology tool that measures film thickness via spectroscopic reflectometry and can generate thickness uniformity maps.

The Filmetrics R50 – 200 – 4PP is a metrology tool configured by default for metallic layers and sample thicknesses of 525 µm ± 25 µm.

The Nikon MM40 is an inspection and 2-D metrology microscope.

The SCIEX API 2000 is a compact triple-quadrupole LC/MS/MS system introduced in 1998.

The Tegal 421 (Plasmaline 421) is a barrel-type oxygen plasma asher used for photoresist stripping.

The KLA 2132 is a patterned wafer defect inspection tool that uses brightfield, small-pixel, high data rate digital image processing to detect yield-relevant defects.

The Disco 3220 is a dicing saw used for wafer singulation in semiconductor backend processing.

The Veeco 4-point probe measures sheet resistance and material resistivity of semiconductor wafers and resistive films.

The Disco DAD3240 is an automatic dicing saw used for cutting semiconductor wafers into individual chips or dies.

The KLA 1007 is a wafer prober manufactured by KLA.

The Hitachi S-4700 is a field emission scanning electron microscope used for detailed image analysis and equipped with EDX capabilities.

The Epson TP-80 (also known as the TX-80) is an 80-column dot matrix printer released in June 1978.

The Oxford NGP80 RIE is a plasma etch system located in room W1-062.

The Olympus MX51 is a universal reflected-light large stage microscope for industrial and semiconductor inspection, supporting brightfield, darkfield, and fluorescence observation.

The Cascade Microtech 103-754 is an x-y-z-θ probe positioner used in the HFTL 50-GHz Small-Signal Probe Station.

The LTX-Credence TS 88 is a semiconductor testing machine described as an automated inspection and testing device for post-manufacturing use.

The PR Hoffman 43T is a 43-tooth insert carrier for double-sided planetary lapping and polishing machines.

The Filmetrics F-40-UV is a microscope-mounted optical reflectometer for rapid thin film thickness and optical constants measurements.

The Lam 839 800327 509 B is an electrostatic chuck.

The Samsung Galaxy S 4G is a smartphone released in February 2011 with a 4.0-inch Super AMOLED display, 1 GHz Hummingbird processor, and 5 MP camera.