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Leica

RES102

Ion millLeica RES102 family
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The Leica RES102 is an ion mill for sample preparation and precision micro-milling. The Leica RES102 is used to thin, clean, polish, and cross-section samples for TEM, SEM, and LM preparation. The Leica RES102 supports ion beam energy from 0.8 keV to 10 keV.[1][2][3]

RES102 — uwaterloo.ca
Fig. 01RES102uwaterloo.ca[1]

Power

90–260 VAC, 50/60 Hz[3]

Gas delivery

Argon (Ar 5.0)[3]

How it works

The Leica EM RES102 uses high energy ion bombardment to remove material or modify the surface of a sample. The Leica EM RES102 has two saddlefield ion sources with variable ion energy. The Leica EM RES102 can perform high-energy milling and also very gentle sample processing using low ion energy. The Leica EM RES102 can be equipped with a variety of sample holders for the preparation of TEM, SEM, and LM samples. The Leica EM RES102 has fully computer-controlled milling parameters and external control of the milling process via LAN. The Leica EM RES102 also uses a load-lock system for sample transfer.[3]

Applications

The Leica EM RES102 is used to prepare samples for TEM, SEM, and LM work. The Leica EM RES102 can thin, clean, polish, cut slopes, and structure samples. The Leica EM RES102 supports surface cleaning, polishing, contrast enhancement, and cross-sectioning of layered or structured materials. The Leica EM RES102 can be used for FIB cleaning to reduce amorphized layers. The Leica EM RES102 can process samples for both SEM and TEM applications with a variety of beam energies and a variety of sample holders.[1][2][3]

  • TEM sample preparation
  • SEM sample preparation
  • Thinning samples
  • Cleaning samples
  • Polishing samples
  • Precision micro-milling

What do the numbers mean?

Power & electrical1

Supply voltage
90–260 VAC, 50/60 Hz[3]
Accurate?

Vacuum & pumping1

Vacuum system
Oil-free, < 1 × 10^-5 mbar, four stage system diaphragm and turbo molecular pump (70 l/s)[3]
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Gas & chemistry1

Gas used
Argon (Ar 5.0)[3]
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Performance2

Purpose
Sample preparation and precision micro-milling of various solid materials for TEM and SEM[1]
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Purpose
Sample preparation and precision micro-milling of various solid materials for transmission electron microscopy (TEM) and scanning electron microscopy (SEM)[1]
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Dimensions & facilities2

Dimensions
720 mm W × 700 mm D × 950 mm H[3]
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Net weight
~100 kg[3]
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Configuration & options15

Model
EM RES102[1]
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Equipment description
Used to thin, clean and polish samples for TEM or SEM imaging[1]
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System feature
Multiple sample holders for SEM and TEM sample preparation[1]
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System feature
Integrated applications library[1]
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System feature
Programmable process parameters[1]
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OEM
Leica[1]
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Ion source
Two saddle-field gun with large area milling properties[3]
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Ion energy
0.8 keV to 10 keV[3]
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Source current
Up to 4.5 mA per ion source[3]
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Maximum sample size, SEM holder
Ø 25 mm × 12 mm[3]
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Prepared area, SEM holder
Max. Ø 25 mm[3]
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Sample size, TEM and FIB holder
Ø 3 mm or Ø 2.3 mm[3]
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Sample size, SEM clamp holder
Max. 5 mm (H) × 7 mm (W) × 2 mm (D)[3]
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Sample size, SEM slope cut holder
Max. 5 mm (H) × 5 mm (W) × 3 mm (D)[3]
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Power consumption
Max. 400 W[3]
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Vintage & configurations

  1. 2026End of life[2]

    The EM RES102 is described as an archived product and phased out.

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Gas usedArgon (Ar 5.0)[3]
  • Vacuum systemOil-free, < 1 × 10^-5 mbar, four stage system diaphragm and turbo molecular pump (70 l/s)[3]
  • Supply voltage90–260 VAC, 50/60 Hz[3]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What sample-preparation operations can the Leica EM RES102 perform?

The Leica EM RES102 can thin, clean, and polish samples for TEM or SEM imaging. The Leica EM RES102 can also cut slopes and structure samples. The Leica EM RES102 supports surface cleaning, polishing, contrast enhancement, and cross-sectioning tasks.[1][2][3]

How is the Leica EM RES102 controlled?

The Leica EM RES102 has programmable process parameters and an integrated applications library. The Leica EM RES102 has fully computer-controlled milling parameters and external control of the milling process via LAN.[1][3]

Is the Leica EM RES102 still a current product?

The Leica EM RES102 is an archived product that has been phased out.[2][4]

Not publicly documented

The following facts about the RES102 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented variants, configuration options, or revision breakpoints of the RES102 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the RES102 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the RES102 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the RES102 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the RES102 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (5)Every fact above is drawn from these public sources
  1. [1]uwaterloo.ca — uwaterloo.cauwaterloo.ca
  2. [2]leica-microsystems.com — leica-microsystems.comleica-microsystems.com
  3. [3]marinereef.com — marinereef.commarinereef.com
  4. [4]EM RES102 - Downloads &#124; Products &#124; Leica Microsystems — leica-microsystems.comleica-microsystems.com
  5. [5]QNC metrology labs | Quantum-Nano Fabrication and Characterization Facility | University of Waterloo — uwaterloo.cauwaterloo.ca
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Last updated Oct 16, 2026.