MRSI
175
The MRSI 175 is a conductive epoxy dispenser. The MRSI 175 is a servo-controlled X, Y, and Z platform. The MRSI 175 operates on MRSI Systems Windows Workcell software.[1]
Performance
0.0005 inch[1]
Control era
Windows
What it is
The MRSI-175Ag is a conductive epoxy dispenser. The MRSI-175Ag is designed for applications including microwave modules, optical modules, hybrid circuits, multichip modules, and semiconductor packaging. The MRSI-175Ag supports silver filled epoxy, underfill, encapsulation, and solder paste applications.[1]
How it works
The MRSI-175Ag is a servo-controlled X, Y, and Z platform. The MRSI-175Ag has two heads that can be configured individually with dispense technologies including positive displacement, time pressure, and jetting. The MRSI-175Ag also offers a stamp head. The standard pump type is a servo rotary positive displacement pump. The MRSI-175Ag can repeatedly stamp dots as small as 0.005 inch. The MRSI-175Ag routinely dispenses ten mil diameter dots of silver filled conductive epoxy for microwave module applications. The Z axis accuracy is 0.0005 inch.[1]
Where it fits in the process flow
The MRSI-175Ag operates standalone, in-line, and cassette-to-cassette. The MRSI-175Ag can also operate in a conveyor mode. The MRSI-175Ag uses MRSI Systems Windows Workcell software, and dispense programs generated on the MRSI-175Ag can be used to create placement programs on MRSI die bonders. The MRSI-175Ag shares the same software platform with other MRSI assembly equipment and is SMEMA compatible.[1]
Applications
The MRSI-175Ag is used for microwave modules, optical modules, hybrid circuits, multichip modules, and semiconductor packaging. The MRSI-175Ag is used for silver filled epoxy dispensing, underfill, encapsulation, and solder paste processes. The MRSI-175Ag can switch between epoxy dispensing and encapsulation applications by changing a drop-in pump cartridge.[1]
- Microwave modules
- Optical modules
- Hybrid circuits
- Multichip modules
- Semiconductor packaging
- Silver Filled Epoxy
- Underfill
- Encapsulation
- Solder Paste
What do the numbers mean?
Vacuum & pumping4
Performance2
Control & software1
Configuration & options11
Vintage & configurations
Control-system eraWindows[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Head configurationTwo pumps or one pump and one interchangeable stamping tool[1]
- Supported dispense technologiesPositive displacement, time/pressure, and jetting[1]
- Pump typeServo rotary positive displacement; others available[1]
- Pump typeStandard: Servo Rotary Positive Displacement; others available[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What dispense head configurations does the MRSI-175Ag support?
The MRSI-175Ag has two heads. The heads can be configured as two pumps or as one pump with one interchangeable stamping tool. The heads can be configured individually with positive displacement, time pressure, and jetting technologies.[1]
What software does the MRSI-175Ag use?
The MRSI-175Ag operates on MRSI Systems Windows Workcell software. The software includes a dispense pattern library with dots, lines, area fills, spirals, arcs, and star patterns. The software also supports calibration routines, offline programming, and CAD download.[1]
Not publicly documented
The following facts about the 175 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 175 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 175 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
No publicly documented failure modes or field errata for the 175 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 175 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 175 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
Last updated Oct 17, 2026.