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MRSI

175

Conductive epoxy dispenserMRSI 175 family
Research Quality: 40% complete
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175 — web.archive.org
Fig. 01175web.archive.org[1]

Performance

0.0005 inch[1]

Control era

Windows

What is it?

The MRSI-175Ag is described as a conductive epoxy dispenser designed for process control and dispense capability in applications including microwave modules, optical modules, hybrid circuits, multichip modules, and semiconductor packaging. It uses a servo-controlled X, Y, and Z platform, supports multiple dispense technologies, and operates on MRSI Systems Windows Workcell software.

What can it run?

Process applications and technology nodes documented for this tool.

  • Microwave modules
  • Optical modules
  • Hybrid circuits
  • Multichip modules
  • Semiconductor packaging
  • Silver Filled Epoxy
  • Underfill
  • Encapsulation
  • Solder Paste

What do the numbers mean?

Vacuum & pumping3

Head configuration
Two pumps or one pump and one interchangeable stamping tool[1]
Accurate?
Supported dispense technologies
Positive displacement, time/pressure, and jetting[1]
Accurate?
Pump type
Servo rotary positive displacement; others available[1]
Accurate?

Performance1

Z axis accuracy
0.0005 inch[1]
Accurate?

Control & software1

Software
MRSI Systems Windows Workcell Software[1]
Accurate?

Configuration & options7

Product type
Conductive epoxy dispenser[1]
Accurate?
Platform
Servo-controlled X, Y, and Z platform[1]
Accurate?
Number of heads
Two[1]
Accurate?
Stamping tip capability
Stamps dots as small as 0.005 inch[1]
Accurate?
Vision system
Edge detection and pattern match[1]
Accurate?
Lighting
Programmable intensity ring and collimated[1]
Accurate?
Applications
Silver Filled Epoxy, Underfill, Encapsulation, Solder Paste[1]
Accurate?

Vintage & configurations

Control-system eraWindows[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Head configurationTwo pumps or one pump and one interchangeable stamping tool[1]
  • Supported dispense technologiesPositive displacement, time/pressure, and jetting[1]
  • Pump typeServo rotary positive displacement; others available[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the 175 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 175 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 175 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • No publicly documented failure modes or field errata for the 175 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 175 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 175 are on record.

    Answerable by: an OEM parts catalog or a service engineer

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
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Last updated Jul 29, 2026.