Mydata
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Pick-and-place machines retrieve electronic components from feeders and place them onto a printed circuit board at programmed locations.
The machine is designed to perform assembly operations by selecting components from supply feeders and positioning them on a board.
In surface-mount technology assembly, pick-and-place machines follow solder paste printing and precede soldering in the process flow.
The MY 12 E is used to populate a printed circuit board with components after solder paste has been applied.
The Mycronic / Mydata MY 12 E is employed in the assembly of printed circuit boards for a variety of electronic products.
The machine applies components to the board in a step prior to reflow soldering.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| MY 12 E | — | 2006 | — | Equipment inventory listing[1] |
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The following facts about the MY 12 E are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MY 12 E are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the MY 12 E are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MY 12 E are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the MY 12 E is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the MY 12 E are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Aug 20, 2026.