PB6

The YES PB6 is a tabletop vacuum curing system in the PB Series. The YES PB6 was also referred to as a vacuum cure oven. Support for the YES-PB6 vacuum cure system was discontinued effective January 1, 2021.^[1][3][4][2]

The PB Series performs vacuum processing with pressure control. The PB Series uses vertical laminar gas flow from top to bottom to reduce gas turbulence. The PB Series includes pump and purge cycles to reduce oxygen content. The PB Series includes a chamber exhaust condensate trap to protect vacuum lines, valves, and vacuum pump performance from solvent condensates. The PB Series uses air cooling technology with adjustable air mixing ratio for chamber cooling and ramp-down-rate control. The PB Series offers programmable recipes on a touchscreen, with optional remote process management software.^[1]

The YES-PB6-2P-CP supports sample sizes up to 200mm, up to 50 wafers. The YES-PB6-2P-CP provides 8 temperature profiles and up to 200 recipes. The YES-PB6-2P-CP is a laminar flow high temperature vacuum cure oven with operation up to 450°C.^[2]

The PB Series is used for polyimide, epoxy, and wafer-to-wafer bonding anneal. The PB Series is positioned for advanced packaging, semiconductor front-end anneal and degas, CMOS image sensor work, fan-out wafer level packaging, and RF devices.^[1][4]

The PB Series is used for polyimide and PBO cure, BCB bake, low temperature polymer cure, copper anneal, and low-k dielectric cure. The PB Series is also used for adhesion-sensitive and degas-related work where complete solvent removal, complete imidization, and controlled heating and cooling rates are important.^[1][4]