Comparison ledger
Accretech UF 3000 EX Automatic Wafer, Electroglas 2001 X, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | UF 3000 EX Automatic WaferAccretech | 2001 XElectroglas |
|---|---|---|
| OEM | Accretech | Electroglas |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2000 Product history mention |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech UF 3000 | Electroglas EG 2001 |
| Specifications | ||
| OS Ver | S6.39.BH[2] | — |
| Input | AC 210V Single pulse[2] | — |
| Configuration | 12" Nickel Hot Chucktop[2] | with Hot chuck, profiler, PRM vision module etc.[5] |
| Head Plate Center Hole Size | 528mm[2] | — |
| Type | Automatic wafer prober[3] | — |
| Hot temp controller | Room~150C[2] | — |
| OS version | S6.39.BH[2] | — |
| Chucktop | 12" Nickel Hot Chucktop[2] | — |
| Z stage | Standard Z Force Stage[2] | — |
| Loader | Open Foub Single Loader[2] | — |
| OCR | Type 6 OCR (Rear-Face Only)[2] | — |
| Probe card tray | Auto Probe Card Tray (O)[2] | — |
| Cleaning unit block | Cleaning Unit Block (O), Cleaning Ceramic Plate(X)[2] | — |
| Ports | USB Port; Ethernet Port[2] | — |
| Card holder clamp motor option | No[2] | — |
| Auto tilt option | No[2] | — |
| Configured wafer sizes | 8" or 12" wafers[4] | — |
| Chuck type | Nickel[4] | — |
| FOUP port | Single FOUP port for 25 wafers[4] | — |
| Transport | Dual robotic wafer transport arms[4] | — |
| Alignment | Auto needle alignment; advanced wafer alignment unit; alignment camera E1-500[4] | — |
| Stage | Quad-Pod Z stage[4] | — |
| Interface options | GPIB interface option; Ethernet interface option[4] | — |
| Wafer size | — | 6 inch (150 mm) and 8 inch (200 mm)[7] |
| Channels | — | 40[6] |
| Equipment type | — | Prober[5] |
| Included items | — | Hot chuck, profiler, PRM vision module[5] |
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