Accretech

UF 3000 EX Automatic Wafer

Research Quality: 50% complete

Plate 01ACCRETECH UF3000 WAFER DUMMY TEST VIDEO(F240124FB)
ASE SEMICONDUCTORWatch on YouTube
Plate 02UF3000 ACCRETECH/TSK Wafer Prober System
Gustavo OrtegaWatch on YouTube
Plate 03UF3000 TSK/ACCRETECH Wafer Prober System
Gustavo OrtegaWatch on YouTube

What it is

The Accretech UF 3000 EX Automatic Wafer is an automatic wafer prober used in semiconductor test and probe work.^[1]^[7]

The UF 3000 EX is part of the UF 3000 family of wafer prober equipment.^[7]

How it works

The UF 3000 EX includes an open FOUP single loader, a hot temperature controller with a room-to-150C range, a 12-inch nickel hot chucktop, a standard Z force stage, rear-face-only OCR, an auto probe card tray, a cleaning unit block, USB and Ethernet ports, and no card holder clamp motor option or auto tilt option.^[1]^[7]

Where it fits in the process flow

The UF 3000 EX is used with test systems and supports wafer handling, alignment, and probe contact during device characterization and production test.^[8]^[7]

What do the numbers mean?

Power & electrical1

Input: AC 210V Single pulse^[1]

Wafer handling8

Open Foub Single Loader^[1]
Type: Automatic wafer prober^[7]
Loader: Open Foub Single Loader^[1]
Configured wafer sizes: 8" or 12" wafers^[8]
Chuck type: Nickel^[8]
FOUP port: Single FOUP port for 25 wafers^[8]
Transport: Dual robotic wafer transport arms^[8]
Alignment: Auto needle alignment; advanced wafer alignment unit; alignment camera E1-500^[8]

Control & software3

Hot Temp Controller (Room~150C)^[1]
Hot temp controller: Room~150C^[1]
Interface options: GPIB interface option; Ethernet interface option^[8]

Configuration & options21

OS Ver: S6.39.BH^[1]; 12" Nickel Hot Chucktop^[1]; Standard Z Force Stage^[1]; Type 6 OCR (Rear-Face Only)^[1]
Head Plate Center Hole Size: 528mm^[1]; Auto Probe Card Tray (O)^[1]; Cleaning Unit Block (O), Cleaning Ceramic Plate(X)^[1]; USB Port^[1]; Ethernet Port^[1]; No Card Holder Clamp Motor Option^[1]; No Auto Tilt Option^[1]
OS version: S6.39.BH^[1]
Chucktop: 12" Nickel Hot Chucktop^[1]
Z stage: Standard Z Force Stage^[1]
OCR: Type 6 OCR (Rear-Face Only)^[1]
Probe card tray: Auto Probe Card Tray (O)^[1]
Cleaning unit block: Cleaning Unit Block (O), Cleaning Ceramic Plate(X)^[1]
Ports: USB Port; Ethernet Port^[1]
Card holder clamp motor option: No^[1]
Auto tilt option: No^[1]
Stage: Quad-Pod Z stage^[8]

Interested in this tool?

Need help with this tool?Embed spec card

What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

Tokyo Electron P 12 XL— Same function class: Test & Probe, nullCompare in depthsource^[9]
Electroglas 2001 X— Same function class: Test & Probe, nullCompare in depthsource^[10]
Electroglas 2001 CX— Same function class: Test & Probe, nullCompare in depthsource^[11]
Electroglas EG 4090 u+— Same function class: Test & Probe, nullCompare in depthsource^[12]
MicroCraft E 4 H 6151 Flying— Same function class: Test & Probe, nullCompare in depthsource^[13]
Electroglas EG 4090— Same function class: Test & Probe, nullCompare in depthsource^[14]

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

InputAC 210V Single pulse^[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Worked with this tool? Help preserve its knowledge →

Frequently asked questions

What type of equipment is the UF 3000 EX?

It is an automatic wafer prober.^[1]

Does the configuration include temperature control?

Yes. It includes a hot temp controller with a room-to-150C range.^[1]

Not publicly documented

The following facts about the UF 3000 EX Automatic Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UF 3000 EX Automatic Wafer are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the UF 3000 EX Automatic Wafer are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the UF 3000 EX Automatic Wafer are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the UF 3000 EX Automatic Wafer are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the UF 3000 EX Automatic Wafer is not on record.
Answerable by: an OEM datasheet or a fab qualification report