Electroglas
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The Electroglas 2001 X is an automatic wafer prober. Wafer probers are semiconductor test and measurement systems used to perform electrical testing of integrated circuits while the devices are still in wafer form. The 2001 X was designed and manufactured by Electroglas, a supplier of wafer probing equipment. The machine is a production-proven platform for semiconductor wafer probing.
The Electroglas 2001 X is an automatic wafer prober. An automatic wafer prober moves a wafer beneath a set of probe needles arranged on a probe card. The prober precisely positions the wafer so that the probe needles contact the electrical test pads of each die on the wafer. A connected test system then exercises the die and measures its electrical response. The prober steps the wafer from die to die, repeating the contact and test sequence for every device on the wafer. The Electroglas 2001 X uses an X-Y stage and a Z-stage to control wafer positioning and probe contact. The machine can be configured with a cassette transfer module for automated wafer handling, including a cassette transfer auto configuration. The prober may include a microscope assembly, a monitor and display system, a joystick or control panel for manual operation, and a probe card alignment capability.[1][2][8]
The Electroglas 2001 X prober can be configured with a hot chuck for thermal probing and a profiler. The machine may include a PRM (Probe to Pad Alignment) vision module. The prober has been used with a Hewlett-Packard 4062 parametric test system for leakage and oxide breakdown testing. The Electroglas 2001 X has been used in focused ion beam (FIB) capacitor test structures for electrical characterization.[1][9]
The Electroglas 2001 X is used for semiconductor wafer probing, parametric testing, device characterization, and wafer-level electrical test. The machine is suitable for MEMS wafer probing, compound semiconductor wafer probing, university and institute research applications, and production-support wafer test. The prober has been used in focused ion beam (FIB) capacitor test structures for leakage and breakdown voltage measurements.[8][9]
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The Electroglas 2001 X can be configured for 6 inch (150 mm) and 8 inch (200 mm) wafers.[1][2][10][8]
The Electroglas 2001 X is available in configurations with cassette transfer auto handling and without cassette transfer auto handling.[8]
The following facts about the 2001 X are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2001 X are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2001 X are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2001 X are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2001 X are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2001 X is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 1, 2026.
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