Applied Materials
0010-47763 ASSY ESC Bonded Monopolar Dual Heated alternatives
Comparable Packaging & Bonding equipment documented in the Waferpedia catalog.
6 comparable tools
Applied Materials
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The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
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The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.
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West Bond
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Packaging & Bonding
West Bond
10490
Packaging & Bonding
The West Bond 10490 is a convertible bonder that can be configured for wedge or ball bonding.
View Engineering
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The VIEW 1101 was a second-generation binary image pattern recognition system introduced in 1982 for automated wirebonding machines and wafer probers.
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