View Engineering
The VIEW 1101 is a second-generation binary image pattern recognition system. The VIEW 1101 is used for automated wirebonding machines and wafer probers.[1]
Pattern recognition systems in semiconductor assembly and test use optical imaging to locate known features on a part or wafer. The machine vision stage of this class of equipment turns visual features into alignment information for the host tool. Binary image approaches in this class generally simplify the image into contrasting regions so that target features can be found and registered for automated handling or contact.
The VIEW 1101 was used for automated wirebonding machines and wafer probers. The VIEW 1101 provided automated pattern recognition for wirebonding machines.[2][1]
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The following facts about the 1101 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the 1101 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 1101 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 1101 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 1101 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 1101 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Last updated Oct 19, 2026.
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