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0010-47763 ASSY ESC Bonded Monopolar Dual Heatedversus850 LT

Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, EV Group 850 LT, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
850 LTEV Group
OEMApplied MaterialsEV Group
CategoryPackaging & BondingPackaging & Bonding
Wafer size—Wafer ID Reader
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedEV Group 850
Cited variants—
Specifications
ConfigurationRefurbished[2]Basic Unit[3]
Software—EVG CIMFramework (without license)[3]
Wafer size—Wafer ID Reader[3]
Model—850 LT[4]
OEM—EV Group[4]
Wafer sizes—8 inch[3]
System type—Automated SOI / Direct Wafer Bonding System[1]
Application focus—SOI substrate manufacturing[1]
Process steps combined—Cleaning, alignment, pre-bonding, and IR-inspection[1]
Production mode—High volume production[1]
Maximum wafer size stated—Up to 300 mm wafers[1]
Thickness—300 μm - 800 μm[3]
Category—Packaging & Bonding[4]
Automation—Fully-automatic[5]
Wafer size capability—Up to 300 mm wafers[1]
Wafer setup thickness—300 μm - 800 μm[3]
Wafer ID Reader—Included[3]
LowTemp plasma activation—Used[1]
Cleaning module—One Cleaning Module[5]
Spinner chuck—One Spinner Chuck for 8”/200mm wafers[5]
DI water dispense line—One DI Water Dispense Line[5]
LowTemp plasma activation module—One LowTemp Plasma Activation Module[5]
Control interface—PC controlled with Windows based graphical user interface[5]
Access control—Password protected access levels[5]
High frequency RF generator—With matching unit[5]
Low frequency RF generator—With matching unit[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com
  5. [5]waferpedia.comwaferpedia.com