EV Group
850 LT
The EVG 850 LT is an automated SOI / direct wafer bonding system. The EVG 850 LT is designed for high volume production. The EVG 850 LT combines cleaning, alignment, pre-bonding, and IR-inspection in one system.[1][2]
Wafer size
Wafer ID Reader
Power
With matching unit[4]
What it is
The EV Group 850 LT is an automated SOI and direct wafer bonding system. The EV Group 850 LT is intended for mechanically aligned SOI and direct wafer bonding with LowTemp plasma activation. The EV Group 850 LT is designed for high volume production. The EV Group 850 LT combines cleaning, alignment, pre-bonding, and IR inspection in one system.[1][3][5]
How it works
The EV Group 850 LT can include a fully automated ergo load cassette station, material mapping units, an additional standard pre-aligner, a wafer ID reader, rejected wafer sorting software, and SECS/GEM and EDA interfaces. The EV Group 850 LT can also include spinner chuck cleaning capability for 100 mm to 200 mm wafers, DI water dispense, chemistry lines, nitrogen drying, a vacuum system for the bond module, and high frequency and low frequency RF generators with matching units.[2][3]
Where it fits in the process flow
The EV Group 850 LT sits after wafer cleaning and surface preparation and before downstream anneal or layer transfer steps used to complete bonded substrate formation. The EV Group 850 LT is used in SOI manufacturing, where accurate bonding is a key factor in obtaining high quality single crystalline silicon films on insulating substrates.[3][1]
Applications
General reference — not yet source-verifiedWafer bonders are used wherever whole wafers must be joined with controlled interface quality for substrate creation, layer transfer, stacked device construction, or cavity sealing. Plasma activated direct bonding is used when processes seek stronger initial interface formation at lower thermal budget than a purely untreated surface approach.
What do the numbers mean?
Power & electrical2
Wafer handling16
Performance1
Control & software6
Configuration & options23
- Basic Unit[2]
- Handling Unit[2]
- High Performance SOI Quality Capabilities[2]
- Facility connections Through Machine Bottom Side[2]
- Modular Machine Platform[2]
- Material Mapping Unit (MMU) (4)[2]
- Additional Standard Pre-Aligner[2]
- Filter Fan Unit ISO 3 for Process and Handling Area[2]
- Filter Fan Unit ISO 3 for Process and Handling Area for 5th Module[2]
- Activated Carbon Filters[2]
- Ionizer Bar for Handling Area T-Frame[2]
- Charge Plate Monitor[2]
- Charge Plate[2]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| EVG850LT | — | — | — | web.archive.org[1] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What automation and interface features can the EV Group 850 LT include?
The EV Group 850 LT can include a fully automated ergo load cassette station, material mapping units, an additional standard pre-aligner, a wafer ID reader, SECS/GEM, and EDA equipment data acquisition interface A. The EV Group 850 LT can also include rejected wafer sorting software and EVG CIMFramework software without license.[2]
Not publicly documented
The following facts about the 850 LT are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 850 LT are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 850 LT are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 850 LT are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 850 LT is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 850 LT are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]web.archive.org — evgroup.com (Mar 12, 2017)web.archive.org
- [2]Inventory photo
- [3]waferpedia.com — waferpedia.comwaferpedia.com
- [4]waferpedia.comwaferpedia.com
- [5]EVG®850 LT — ies.co.ukies.co.uk
Last updated Oct 19, 2026.
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