Comparison ledger
Applied Materials 0010 47763, Plasma-Therm Versalock 700 ICP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010 47763Applied Materials | Versalock 700 ICPPlasma-Therm |
|---|---|---|
| OEM | Applied Materials | Plasma-Therm |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010 47763 | Plasma-Therm Versalock 700 ICP |
| Specifications | ||
| Configuration | 2nd Source New[1] | Dual Chamber Etcher[4] |
| Type | Monopolar Dual Heated[2] | — |
| Description | ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3] | — |
| Possible Materials | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Model | 0010-47763[1] | — |
| OEM | Applied Materials[1] | — |
| Material (possible) | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Application | Fixing wafers in etching process (PVD, CVD, ETCH)[2] | — |
| Quantity available (source) | 1[2] | — |
| Phase | — | 3 Phase[5] |
| Frequency | — | 60 Hz[5] |
| Voltage | — | 208V[5] |
| Pumps | — | 3 Edward Pumps[4] |
| Chillers | — | 2 Neslab Chillers[4] |
| Control system update | — | Vortex Computer Update[4] |
| Vintage | — | 1998[5] |
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