Comparison ledger
Applied Materials Centura eMax Nitride, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Centura eMax NitrideApplied Materials | 110Tegal |
|---|---|---|
| OEM | Applied Materials | Tegal |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Centura | Tegal 110 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | 2 Chamber Emax[2] | — |
| Gas | CF4, CH2F2, CHF3, Ar, O2, N2[2] | — |
| OS | AMAT Legacy[2] | — |
| Buffer Robot | HP[2] | — |
| Chiller 1 | AMAT Endura HX 18706-01[2] | — |
| Chiller 2 | Thermo Electron HX 150 106178026[2] | — |
| Wafer size | 8 inch[2] | — |
| Chamber configuration | 2 Chamber Emax; 1 Orienter/degas[2] | — |
| Gas chemistry | CF4, CH2F2, CHF3, Ar, O2, N2[2] | — |
| Operating system | AMAT Legacy[2] | — |
| Chamber #A | eMAX[2] | — |
| Chamber #B | eMAX[2] | — |
| Chamber #C | EMPTY[2] | — |
| Chamber #D | EMPTY[2] | — |
| Chamber #E | EMPTY[2] | — |
| Chamber #F | Orienter[2] | — |
| Manufacturer | Applied Materials[2] | — |
| Model | Centura eMax[2] | — |
| Category | Etch[3] | — |
| Process gases | CF4, CH2F2, CHF3, Ar, O2, N2[2] | — |
| Chambers | 2 Chamber Emax[2] | — |
| Module | 1 Orienter/degas[2] | — |
| CH #A | eMAX[2] | — |
| CH #B | eMAX[2] | — |
| CH #C | EMPTY[2] | — |
| CH #D | EMPTY[2] | — |
| CH #E | EMPTY[2] | — |
| CH #F | Orienter[2] | — |
| model | — | 110 SE[1] |
| application focus | — | process development applications[1] |
| process capability | — | deep silicon plasma etching[1] |
| capabilities | — | very high aspect ratio trench etch and profile control[1] |
| configuration | — | multiple configurations with minimum technical intervention[1] |
| System type | — | plasma etch system[4] |
| Supported components | — | MEMS and 3D-IC components[1] |
| Control capability | — | very high aspect ratio trench etch and profile control[4] |
| Physical description | — | compact[1] |
Plan your fab
Building a Etch process? Get a complete equipment list.
Open the fab equipment planner →