Comparison ledger
Applied Materials Centura TPCC RTP XE+, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Centura TPCC RTP XE+Applied Materials | 110Tegal |
|---|---|---|
| OEM | Applied Materials | Tegal |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Centura TPCC | Tegal 110 |
| Cited variants | — |
|
| Specifications | ||
| CH A | XE+ Non-Toxic ATM[2] | — |
| Configuration | Chemraz O-Ring[2] | — |
| Edge Ring | S2[2] | — |
| Bearing Type | Standard[2] | — |
| CH B | Empty[2] | — |
| CH C | Empty[2] | — |
| CH D | Empty[2] | — |
| CH E | Single Slot Fast Cooldown[2] | — |
| CH F | Single Slot Fast Cooldown[2] | — |
| Gas Line Purge | N2-10 SLM[2] | — |
| Gas Line 1 | 02-10 SLM[2] | — |
| Wafer Size | 8 inch[2] | — |
| Chamber A Configuration | XE+ Non-Toxic ATM - Chemraz O-Ring - RGA Port and Valve - MWBC - Edge Ring: S2 Bearing Type: Standard[2] | — |
| Chamber E and F Configuration | Single Slot Fast Cooldown[2] | — |
| Robot | Asyst LPT2200 SMIF Robot[2] | — |
| Controller | Vita Computer Controller (Modular Controller)[2] | — |
| Gas Delivery | 10 Ra Gas Panel, Top Feed Gas Line Input, Multiple Line Drop Gas Distribution, Gas Line Purge: N2-10 SLM, Gas Line 1: O2-10 SLM, Gas Line 2: N2-20 SLM, Gas Line 3: O2 1 SLM, STEC Z500 MFC Type First Manifold[2] | — |
| Heat Exchanger | SMC 40 GPM Stainless Steel Heat Exchanger[2] | — |
| Gas Line 2 | N2-20 SLM[2] | — |
| Gas Line 3 | 02 1SLM SLM[2] | — |
| Gas Line 4 | None[2] | — |
| model | — | 110 SE[1] |
| application focus | — | process development applications[1] |
| process capability | — | deep silicon plasma etching[1] |
| capabilities | — | very high aspect ratio trench etch and profile control[1] |
| configuration | — | multiple configurations with minimum technical intervention[1] |
| System type | — | plasma etch system[3] |
| Supported components | — | MEMS and 3D-IC components[1] |
| Control capability | — | very high aspect ratio trench etch and profile control[3] |
| Physical description | — | compact[1] |
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