Applied Materials
Centura TPCC RTP XE+
What it is
General reference — not yet source-verifiedThe Applied Materials Centura is a modular multichamber cluster platform used in semiconductor manufacturing.
How it works
General reference — not yet source-verifiedThe Centura platform uses a central wafer-handling robot to transfer wafers among multiple process chambers and load locks. Etching is performed by exposing the wafer to a chemically reactive plasma in a dedicated process chamber.
What do the numbers mean?
Wafer handling2
Gas & chemistry9
- Gas Delivery Options:[1]
- 10 Ra Gas Panel[1]
- Top Feed Gas Line Input[1]
- Multiple Line Drop Gas Distribution[1]
- Individual Gas Line Lockout Tagout[1]
- STEC Z500 MFC Type[1]
- Gas Delivery
- 10 Ra Gas Panel, Top Feed Gas Line Input, Multiple Line Drop Gas Distribution, Gas Line Purge: N2-10 SLM, Gas Line 1: O2-10 SLM, Gas Line 2: N2-20 SLM, Gas Line 3: O2 1 SLM, STEC Z500 MFC Type First Manifold[1]
Control & software1
Configuration & options15
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ConfigurationGas Delivery Options:[1]
- Configuration10 Ra Gas Panel[1]
- ConfigurationTop Feed Gas Line Input[1]
- ConfigurationMultiple Line Drop Gas Distribution[1]
- ConfigurationIndividual Gas Line Lockout Tagout[1]
- ConfigurationSTEC Z500 MFC Type[1]
- Gas Line PurgeN2-10 SLM[1]
- Gas Line 102-10 SLM[1]
- Gas Delivery10 Ra Gas Panel, Top Feed Gas Line Input, Multiple Line Drop Gas Distribution, Gas Line Purge: N2-10 SLM, Gas Line 1: O2-10 SLM, Gas Line 2: N2-20 SLM, Gas Line 3: O2 1 SLM, STEC Z500 MFC Type First Manifold[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
How many process chambers does the system have?
The system has six chamber positions: Chamber A is an XE+ non-toxic atmospheric etch chamber, Chambers B, C, and D are empty, and Chambers E and F are single-slot fast cooldown stations.[1]
What type of wafer-handling robot does the system use?
The system uses an Asyst LPT2200 SMIF robot.[1]
What controller is used in this system?
The system uses a Vita Computer Controller (Modular Controller).[1]
What gas delivery features are included?
The gas delivery system includes a ten-RA gas panel with top feed gas line input, multiple line drop gas distribution, individual gas line lockout tagout, and an STEC Z500 MFC type first manifold.[1]
Not publicly documented
The following facts about the Centura TPCC RTP XE+ are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Centura TPCC RTP XE+ are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Centura TPCC RTP XE+ are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Centura TPCC RTP XE+ are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Centura TPCC RTP XE+ are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Centura TPCC RTP XE+ is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]inventory listing
Last updated Aug 14, 2026.