Waferpedia

Comparison ledger

A 400versus1000 Hot Plate

ASM A 400, CEE 1000 Hot Plate, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMASMCEE
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyASM A 400CEE 1000 Hot Plate
Cited variants
  • A400 (Wet Ox / Wet O)[1]
  • A400 (TEOS / Nitride)[2]
  • A400 (Poly / Nitride)[3]
  • A400 (BPSG)[4]
—
Specifications
ConfigurationWet Ox / Wet O[1]4"[6]
Vintage2008—
Furnaces / Diffusion Vintage2008—
Wafer Size8 inch (200 mm)[1]4 inch[6]
Process CapabilitiesOxidation/Diffusion, LPCVD, ALD[5]—
Configured Processes (sourced listings)Wet Ox/Wet O, TEOS/Nitride, Poly/Nitride, BPSG[1]—
ProcessesOxidation, Diffusion, LPCVD, ALD[5]—
TypeBatch Vertical Furnace[5]Hot Plate[6]
ModelA 400[1]—
Product typeBatch vertical furnace[5]—

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Sources (6)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]Equipment inventory listing
  5. [5]web.archive.orgweb.archive.org
  6. [6]inventory listing