A 400

Furnaces of this class are wafer processing tools used for high temperature thermal steps on batches of wafers. Vertical furnace systems generally support processes such as oxidation, diffusion, and chemical vapor deposition in tube-based chambers.

Batch vertical furnaces process multiple wafers together in a heated reaction tube. Thermal furnace processes typically rely on controlled temperature and gas exposure to grow films, drive dopants, or deposit conformal layers on wafer surfaces.

Thermal and diffusion furnaces sit in the wafer fabrication flow wherever a process sequence requires a high temperature film growth, dopant drive, or deposited layer formed in a batch reactor. Furnace steps commonly interact with earlier cleaning and patterning operations and with later etch, implant, planarization, or metallization steps depending on the layer being formed.

Furnaces of this class are used to grow oxide layers, diffuse dopants, and deposit films needed for isolation, dielectric formation, gate stack preparation, and interlayer structures. LPCVD and related thermal processes are commonly chosen when a process requires uniform batch treatment and film formation driven by heat and reactive gases.