Comparison ledger
ASML PAS 5500 and GCA AS200, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | PAS 5500ASML | AS200GCA |
|---|---|---|
| OEM | ASML | GCA |
| Category | Lithography | Lithography |
| Wafer size | 200mm | 200mm |
| Process node | 280 nm | — |
| Introduced | 2000 | — |
| Production run | 2000–2010 | — |
| Lifecycle | Legacy | — |
| Lifecycle milestones | 1995 ASML PAS 5500/400 release | — |
| Control system | — | — |
| Generation | i-line | i-line |
| Family | ASML PAS 5500 | GCA AS200 |
| Cited variants | — | |
| Specifications | ||
| Technology | i-line stepper[1] | — |
| Exposure wavelength | 365 nm[1] | — |
| Reduction | 5X reduction[1] | 5X[7] |
| Resolution | 280 nm[1] | — |
| Wafer handling | Fully automated wafer handling system[1] | — |
| Supported substrate diameter | 200 mm diameter wafers down to small pieces[1] | — |
| Throughput | 84 wafers per hour[1] | — |
| Minimum resolution | 0.45 μm[2] | — |
| Mask size | 5 inch[2] | — |
| Substrate size | 4 inch wafer; 150 mm capable with advanced notice[2] | — |
| Substrate types | Silicon, Silicon Germanium, Quartz, Sapphire, Glass[2] | — |
| Wafer sizes | 100 mm default; 150 mm on request[3] | — |
| Alignment | Topside and backside alignment[3] | uDFAS Die-by-Die Alignment[7] |
| Model | — | AS200[7] |
| OEM | — | GCA[7] |
| Machine name | — | AutoStep 200 DSW i-line Wafer Stepper[7] |
| Maximum wafer size | — | up to 200 mm wafers[7] |
| Wafer stage | — | 200 mm Wafer Stage[7] |
| Optics NA | — | 0.45 N.A.[7] |
| Lens | — | Tropel i-line Lens[7] |
| Exposure field | — | 15 mm[7] |
| Illumination | — | Annular and Quadrupole illumination available[7] |
| Feature size specification | — | 0.65 µm features[7] |
| Overlay specification | — | <0.125 µm using local alignment[7] |
| Focus repeatability | — | <0.2 µm[7] |
| Automation | — | All operations are automated, including wafer loading, aligning, reticle loading and aligning[7] |
| Wafer leveling | — | Used to provide optimum focus range[7] |
| Automatic calibrations | — | All tool calibrations are performed automatically[7] |
| Focus compensation | — | Compensated for lens heating and barometric shifts[7] |
| Reticle management | — | Reticle Management System (up to 10 reticles)[7] |
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