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Comparison ledger

200 PCUversusGSD 200 E 2 Ion

Axcelis 200 PCU, Axcelis GSD 200 E 2 Ion, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 PCUAxcelis
OEMAxcelisAxcelis
CategoryIon ImplantationIon Implantation
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones2000 Vintage—
Control system——
Generation——
FamilyAxcelis NV GSD 200Axcelis GSD 200
Cited variants
  • Fusion 200 PCU[1]
  • Fusion 200 PCU-P[2]
—
Specifications
P/NSC 4840 A[3]—
Frequency50 Hz[3]—
Phase3 Phase[3]—
Voltage400 V[3]—
High Current—GSD-200EE[4]
Configuration—Software Version 6.12.3[4]
Ion Source Type—ELS[4]
Source Material Type—Moly[4]
Single Stage Extraction—90keV[4]
Beamline Version—Standard[4]
Source Turbo Pump (P1)—STP H2000C[4]
Beam Line Cryo Pump (P3)—CTI Onboard 10[4]
End Station Cryo Pump (P2)—CTI Onboard 8[4]
Manufacturer—Axcelis[4]
Model—GSD 200 E 2[4]
Category—Ion Implantation[5]
Wafer size—6 inch[4]
Software version—6.12.3[4]
GEM/SECS interface—Present[4]
Cassette capability—4-cassette capability[4]
Automated beam tuning and set-up—w/Eaton Autotune[4]
Energy range—90KeV[4]
Beamline and source pumps—Beamline and Source Pumps[5]
Gas Type—MFC Type and Model[4]
Ar—UNIT 1662 10SCCM - SDS[4]
BF3—UNIT 1662 10SCCM - SDS[4]
AsH3—UNIT 1662 10SCCM - SDS[4]
PH3—UNIT 1660 10SCCM - SDS[4]
External Facilities Connections—Ar N2[4]
Cryo Compressors—CTI 9600 (1)[4]
Remote Disk Chiller—SMC-HRS050[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]exapro.comexapro.com
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]waferpedia.comwaferpedia.com