Comparison ledger
Axcelis RapidStrip 210 ES, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | RapidStrip 210 ESAxcelis | 110Tegal |
|---|---|---|
| OEM | Axcelis | Tegal |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 2007 Date of manufacture | — |
| Control system | — | — |
| Generation | — | — |
| Family | Axcelis RapidStrip 210 ES | Tegal 110 |
| Cited variants | — |
|
| Specifications | ||
| Part Number | 1080-6037[2] | — |
| Software Version | 1.8.7.0.06[2] | — |
| Configuration | System On-Line[2] | — |
| System Type | RapidStrip 210 ES[2] | — |
| Number of Cassettes | 2[2] | — |
| Load Type | Standard[2] | — |
| Install Type | Through-the-Wall[2] | — |
| Robot Type | Brooks[2] | — |
| Endpoint Detection Type | Monochromator[2] | — |
| Throttle Valve | MKS[2] | — |
| Foreline Valve | VAT[2] | — |
| Manufacturer | Matrix[2] | — |
| Model | 3kW switchmode powergen[2] | — |
| OEM | Axcelis[2] | — |
| Category | Etch[3] | — |
| Wafer size | 8 inch[2] | — |
| Cooling station | Present[2] | — |
| SECS/GEMS | Yes[2] | — |
| Ozone / microwave generator manufacturer | Matrix[2] | — |
| Ozone / microwave generator model | 3kW switchmode powergen[2] | — |
| Pump | IQDP 80[2] | — |
| Mechanical booster | QMB1200[2] | — |
| System status | System on-line[2] | — |
| CE mark | Certified[2] | — |
| Can produce wafers as-is | Yes[2] | — |
| All cables present | Yes[2] | — |
| System On-Line | Yes[2] | — |
| CE Mark Certified | Yes[2] | — |
| Cooling Station | Yes[2] | — |
| Date of Manufacture | 2007-12-31[4] | — |
| model | — | 110 SE[1] |
| application focus | — | process development applications[1] |
| process capability | — | deep silicon plasma etching[1] |
| capabilities | — | very high aspect ratio trench etch and profile control[1] |
| configuration | — | multiple configurations with minimum technical intervention[1] |
| System type | — | plasma etch system[5] |
| Supported components | — | MEMS and 3D-IC components[1] |
| Control capability | — | very high aspect ratio trench etch and profile control[5] |
| Physical description | — | compact[1] |
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