Comparison ledger
Branson 101-149-053 Gold Booster, EV Group 850 LT, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101-149-053 Gold BoosterBranson | 850 LTEV Group |
|---|---|---|
| OEM | Branson | EV Group |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | Wafer ID Reader |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Branson 101-149-053 Gold Booster | EV Group 850 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | 1:1.5[2] | Basic Unit[5] |
| Manufacturer | Branson[3] | — |
| Model | 101-149-053[3] | 850 LT[6] |
| Type | Gold Booster[3] | — |
| Operating frequency | 20 kHz[4] | — |
| Gain | 1:1.5[3] | — |
| Mounting thread | 1/2-20[4] | — |
| Length | 5.4 in[4] | — |
| Gain ratio | 1:1.5[3] | — |
| Software | — | EVG CIMFramework (without license)[5] |
| Wafer size | — | Wafer ID Reader[5] |
| OEM | — | EV Group[6] |
| Wafer sizes | — | 8 inch[5] |
| System type | — | Automated SOI / Direct Wafer Bonding System[1] |
| Application focus | — | SOI substrate manufacturing[1] |
| Process steps combined | — | Cleaning, alignment, pre-bonding, and IR-inspection[1] |
| Production mode | — | High volume production[1] |
| Maximum wafer size stated | — | Up to 300 mm wafers[1] |
| Thickness | — | 300 μm - 800 μm[5] |
| Category | — | Packaging & Bonding[6] |
| Automation | — | Fully-automatic[7] |
| Wafer size capability | — | Up to 300 mm wafers[1] |
| Wafer setup thickness | — | 300 μm - 800 μm[5] |
| Wafer ID Reader | — | Included[5] |
| LowTemp plasma activation | — | Used[1] |
| Cleaning module | — | One Cleaning Module[7] |
| Spinner chuck | — | One Spinner Chuck for 8”/200mm wafers[7] |
| DI water dispense line | — | One DI Water Dispense Line[7] |
| LowTemp plasma activation module | — | One LowTemp Plasma Activation Module[7] |
| Control interface | — | PC controlled with Windows based graphical user interface[7] |
| Access control | — | Password protected access levels[7] |
| High frequency RF generator | — | With matching unit[7] |
| Low frequency RF generator | — | With matching unit[7] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →