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Comparison ledger

CEE 1100 Large Substrate and Wafer Hot Plateversus200 Spin

Brewer Science CEE 1100 Large Substrate and Wafer Hot Plate, CEE 200 Spin, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMBrewer ScienceCEE
CategoryResist ProcessingResist Processing
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBrewer Science CEECEE 200
Specifications
ConfigurationAccommodates 8" wafers[1]1 Phase[3]
Voltage220 V, 2000 W[1]—
FunctionHot plate for large substrates and wafers[2]—
Wafer handlingAccommodates 8-inch wafers[2]—
Power / electrical220 V, 2000 W[2]—
Phase—1 Phase[3]
Type—Spin Coater[3]
Model—200[3]
Make—CEE[3]
Wafer Sizes—8 inch[3]
Equipment type—Spin Coater[3]
Spin speed—5000 rpm[4]
Substrate support—Flat substrates up to 200 mm or fragments[4]
Substrate thickness max—12 mm[4]
Coating thickness—Uniform coating thickness up to 100 µm[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]amolf.nlamolf.nl