Brewer Science
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The Brewer Science CEE 1100 Large Substrate and Wafer Hot Plate is a hot plate for large substrates and wafers. The Brewer Science CEE 1100 Large Substrate and Wafer Hot Plate accommodates 8-inch wafers. The Brewer Science CEE 1100 Large Substrate and Wafer Hot Plate is specified at 220 V and 2000 W.[1][2]

A resist-processing hot plate heats a wafer or substrate through direct contact with a temperature-controlled plate surface. A hot plate in lithography service is generally used to drive solvent evaporation, promote film stabilization, or support temperature-dependent resist steps. A large-substrate wafer hot plate is typically used as a single-station thermal module rather than as a patterning or coating system.
A wafer hot plate in resist processing sits in the lithography track around coating, bake, exposure, and development operations. A hot plate commonly performs soft-bake, post-exposure-bake, or hard-bake functions depending on the resist flow. A stand-alone hot plate is generally placed downstream of coating and at selected points before or after exposure and development as required by the process.
A resist-processing hot plate is used for thermal steps in photoresist workflows on wafers and other flat substrates. A large-substrate hot plate can support bake steps for imaging resists, adhesion-promotion sequences, and related thin-film process modules that require controlled heating. Such equipment is also used in development environments where process flexibility for different substrate formats is needed.
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The following facts about the CEE 1100 Large Substrate and Wafer Hot Plate are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the CEE 1100 Large Substrate and Wafer Hot Plate are on record.
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No publicly documented variants, configuration options, or revision breakpoints of the CEE 1100 Large Substrate and Wafer Hot Plate are on record.
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The control-system platform and OS era of the CEE 1100 Large Substrate and Wafer Hot Plate are not on record.
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The process node or technology generation of the CEE 1100 Large Substrate and Wafer Hot Plate is not on record.
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Last updated Oct 20, 2026.
Headway 1 EC 101 R 485 is a photoresist spinner with stated vacuum and electrical requirements.
The CEE 100 is a spin coater with a listed power specification of 115 volts and 800 watts.
The EV Group 120 Automated Coater Processing System is an automated coater for 6-inch and 8-inch wafers, built in 2015 and requiring 50/60 Hz, 3-phase, 4-wire plus ground power.