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Comparison ledger

FPA 5510 IXversusNSR-2205i11D

Canon FPA 5510 IX, Nikon NSR-2205i11D, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Documented as functional equivalents— Same function class: Lithography, Unknown[1]
Side-by-side comparison of selected equipment models
Attribute
OEMCanonNikon
CategoryLithographyLithography
Wafer size——
Process node—0.35 micron
Introduced——
Production run—1995–
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCanon FPA 5510Nikon NSR-2205i11D
Specifications
ConfigurationNo hard disk[2]—
Tool type—Step-and-Repeat System[1]
Process node—0.35 micron[1]
Node—0.35 micron[1]
Technology Node—0.35 micron[1]
Type—Step-and-repeat system[1]
Resolution node—0.35 micron[1]
Machine type—Step-and-Repeat System[1]
Target design node—0.35 micron[1]
System type—Step-and-repeat system[1]
Target node—0.35 micron[1]
Design node—0.35 micron[1]
Node (resolution)—0.35 micron[1]
Resolution—0.35 micron[1]
Minimum feature size—0.35 μm[1]
Design Rule—0.35 micron[1]
Feature Size—0.35 micron[1]
Description—State-of-the-art workhorse[1]
Equipment type—Step-and-repeat system[1]
Manufacturer—Nikon[1]
OEM—Nikon[1]
Model—NSR-2205i11D[1]
Described use—Step-and-Repeat System[1]
NA—0.63[3]
Exposure source—i-line (365 nm wavelength)[3]
Reduction ratio—1:5[3]
Maximum exposure field—22 mm × 22 mm[3]
Overlay accuracy—≤ 70 nm (EGA, |M| + 3σ)[3]
Alignment system—LSA (standard), FIA (optional), LIA (optional)[3]
Date of manufacture—01 Sep 1995[4]
Serial number—1105183[4]
Wafer size—8 Inch[4]
Reticle size—6 Inch[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]chiphistory.orgchiphistory.org
  2. [2]inventory listing
  3. [3]jp.nikon.comjp.nikon.com
  4. [4]nteklitho.comnteklitho.com