Nikon
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As a lithography tool, it sits in the front end of semiconductor patterning, where it transfers mask-defined images onto photoresist-coated wafers before subsequent etch and deposition steps define device features.
A step-and-repeat lithography system exposes one field at a time and then moves the wafer to the next field until the full wafer is patterned. The optical system reduces the mask image and projects it onto the photoresist, using precise wafer positioning and overlay control to place each exposure accurately relative to prior layers.
In this class of equipment, the core subsystems are illumination, reticle handling, projection optics, wafer stage motion, and alignment sensors. The tool’s job is to print repeated copies of the same circuit pattern across many die locations with tight positional control.
The NSR-2205i11D is used during wafer patterning after photoresist has been applied and before resist development, etching, or lift-off steps that transfer the pattern into underlying films. It is part of the lithographic definition stage that determines lateral feature placement for later process modules.
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
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It is a step-and-repeat system.[1]
The following facts about the NSR-2205i11D are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the NSR-2205i11D are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the NSR-2205i11D are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the NSR-2205i11D are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the NSR-2205i11D are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the NSR-2205i11D are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Jul 29, 2026.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.