Comparison ledger
CEE 100, EV Group EV 620, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100CEE | EV 620EV Group |
|---|---|---|
| OEM | CEE | EV Group |
| Category | Lithography | Lithography |
| Wafer size | 6" | Does not have the exposure optics. It is just a manual aligner for wafer bonding |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 100 | EV Group EV 620 |
| Cited variants |
| — |
| Specifications | ||
| Tool type | Spray Developer[1] | Bond Aligner[4] |
| Accepts wafer size | up to 6" wafers[2] | — |
| Programmable programs | 10 programs[2] | — |
| Steps per program | up to 10 steps[2] | — |
| Programmable step parameters | Acceleration, Speed, Time[2] | — |
| Associated document | CEE Model 100CB Spinner.doc[2] | — |
| Wafer size | Up to 6 inches[2] | Does not have the exposure optics. It is just a manual aligner for wafer bonding[4] |
| Programs | 10 programs each with up to 10 steps[2] | — |
| Control parameters | Acceleration, Speed, Time[2] | — |
| Equipment type | Spin coater[3] | — |
| Programming | 10 programs; up to 10 steps per program[2] | — |
| Step parameters | Acceleration, speed, time[2] | — |
| Manufacturer | — | EV Group[4] |
| Model | — | EV 620[4] |
| Category | — | Lithography[5] |
| Exposure optics | — | Does not have the exposure optics[4] |
| Operating mode | — | Manual aligner for wafer bonding[4] |
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