EV Group
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

Wafer size
Does not have the exposure optics. It is just a manual aligner for wafer bonding
Optics
Does not have the exposure optics[1]
A bond aligner is used to align wafers before bonding.
A manual aligner relies on operator action rather than automated exposure optics for the alignment task.
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The following facts about the EV 620 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the EV 620 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the EV 620 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the EV 620 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the EV 620 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the EV 620 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 13, 2026.
Brooks 017-0146-01 is a prealigner manufactured by Brooks.
The CEE 100 is a lithography spin coater/developer tool that accepts up to 6-inch wafers and supports programmable multi-step processing.
The Ultratech 1000 Family is a photolithography step-and-repeat 1X steppers family using the Wynne Dyson optical design.