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Comparison ledger

100versusMJB-3

CEE 100, Karl Suss MJB-3, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
100CEE
MJB-3Karl Suss
OEMCEEKarl Suss
CategoryLithographyLithography
Wafer size6"3"
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 100Karl Suss MJB-3
Cited variants—
Specifications
Tool typeSpray Developer[1]—
Accepts wafer sizeup to 6" wafers[2]—
Programmable programs10 programs[2]—
Steps per programup to 10 steps[2]—
Programmable step parametersAcceleration, Speed, Time[2]—
Associated documentCEE Model 100CB Spinner.doc[2]—
Wafer sizeUp to 6 inches[2]—
Programs10 programs each with up to 10 steps[2]—
Control parametersAcceleration, Speed, Time[2]—
Equipment typeSpin coater[3]—
Programming10 programs; up to 10 steps per program[2]—
Step parametersAcceleration, speed, time[2]—
OEM—Karl Suss[4]
Model—MJB-3[4]
Type—Contact/proximity aligner[4]
Illumination wavelengths—365 nm or 405 nm[4]
Resists—Used with a variety of both positive and negative photoresists[4]
Location—FabLab | Teaching Lab[4]
Maximum substrate diameter—up to 3"[4]
Sample compatibility—works for smaller samples[4]
Light options—365 nm or 405 nm light[4]
Photoresist compatibility—a variety of both positive and negative photoresists[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]nanofab.ece.cmu.edunanofab.ece.cmu.edu
  2. [2]nanofab.utah.edunanofab.utah.edu
  3. [3]nanofab.utah.edunanofab.utah.edu
  4. [4]nanocenter.umd.edunanocenter.umd.edu