Comparison ledger
CEE 100, SUSS MicroTec MA 8 BA 8 Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100CEE | MA 8 BA 8 MaskSUSS MicroTec |
|---|---|---|
| OEM | CEE | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | 6" | High precision micrometer for wafer alignment adjustment |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 100 | SUSS MicroTec MA 8 Mask |
| Cited variants |
| — |
| Specifications | ||
| Tool type | Spray Developer[1] | — |
| Accepts wafer size | up to 6" wafers[2] | — |
| Programmable programs | 10 programs[2] | — |
| Steps per program | up to 10 steps[2] | — |
| Programmable step parameters | Acceleration, Speed, Time[2] | — |
| Associated document | CEE Model 100CB Spinner.doc[2] | — |
| Wafer size | Up to 6 inches[2] | High precision micrometer for wafer alignment adjustment[4] |
| Programs | 10 programs each with up to 10 steps[2] | — |
| Control parameters | Acceleration, Speed, Time[2] | — |
| Equipment type | Spin coater[3] | — |
| Programming | 10 programs; up to 10 steps per program[2] | — |
| Step parameters | Acceleration, speed, time[2] | — |
| Configuration | — | Backside Optical Alignment[4] |
| Wafer Loading | — | Manual loading & unloading[4] |
| Microscope Lenses | — | 2× 5× lenses, 2× 10× lenses[4] |
| Power | — | 1000 W UV mercury lamp[4] |
| Micrometer axes | — | X / Y / θ (theta)[4] |
| X / Y minimal travel | — | 10 mm[4] |
| θ-axis maximum rotation angle | — | ±5°[4] |
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