Waferpedia

Comparison ledger

100versus661 HT

CEE 100, SVG 661 HT, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
100CEE
OEMCEESVG
CategoryLithographyLithography
Wafer size6"Mask / Wafer Handling:
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 100SVG 661 HT
Cited variants—
Specifications
Tool typeSpray Developer[1]—
Accepts wafer sizeup to 6" wafers[2]—
Programmable programs10 programs[2]—
Steps per programup to 10 steps[2]—
Programmable step parametersAcceleration, Speed, Time[2]—
Associated documentCEE Model 100CB Spinner.doc[2]—
Wafer sizeUp to 6 inches[2]Mask / Wafer Handling:[4]
Programs10 programs each with up to 10 steps[2]—
Control parametersAcceleration, Speed, Time[2]—
Equipment typeSpin coater[3]Aligner[4]
Programming10 programs; up to 10 steps per program[2]—
Step parametersAcceleration, speed, time[2]—
Configuration—Refurbished in 2022[4]
Process—Photo Exposure[4]
Heat Exchanger / Chiller—Blower[4]
OEM—SVG[4]
Model—661 HT[4]
Category—Lithography[5]
Optics—High Throughput Coated Optics (HT)[4]
Performance—Integrated Uniformity Tester[4]
Software—OS 2000 Hardware and Software v29.x or Higher[4]
Host link—SEMI-GEM E 30 & HSMS # 37 Compliant Host Link[4]
Chamber Type—M 500 / 600[4]
Cassette Stage—150 mm no smf[4]
Wafer Mapping—Optical Sensor[4]
Control System—OS 2000[4]
Air Cooler—39,000 BTU 220 Vac 3 Ф[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]nanofab.ece.cmu.edunanofab.ece.cmu.edu
  2. [2]nanofab.utah.edunanofab.utah.edu
  3. [3]nanofab.utah.edunanofab.utah.edu
  4. [4]inventory listing
  5. [5]waferpedia.comwaferpedia.com