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Comparison ledger

200 SpinversusFalcon

CEE 200 Spin, SUSS MicroTec Falcon, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
FalconSUSS MicroTec
OEMCEESUSS MicroTec
CategoryResist ProcessingResist Processing
Wafer size—Wafer Backside Rinse
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 200SUSS MicroTec Falcon
Specifications
Phase1 Phase[1]—
TypeSpin Coater[1]—
Model200[1]Falcon[4]
MakeCEE[1]—
Wafer Sizes8 inch[1]—
Configuration1 Phase[1]Polyimid[3]
Equipment typeSpin Coater[1]—
Spin speed5000 rpm[2]—
Substrate supportFlat substrates up to 200 mm or fragments[2]—
Substrate thickness max12 mm[2]—
Coating thicknessUniform coating thickness up to 100 µm[2]—
Cassette Elevators—2[3]
Developer Dispensers—2[3]
Wafer size—Wafer Backside Rinse[4]
Number of Hot Plates—0[3]
Number of Chill Plates—0[3]
Controller Type—Microprocessor Controller[3]
Power Requirements—380 V, 50/60 Hz, 3 Phase[3]
OEM—SUSS MicroTec[4]
Category—Resist Processing[4]
Wafer sizes—6, 8 inch[3]
Process—Polyimid[3]
Chambers—2 chambers[3]
Hot plates—0[3]
Chill plates—0[3]
Vintage—1996[3]
Gas delivery—2[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]amolf.nlamolf.nl
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com