Comparison ledger
CEE 200 Spin, SUSS MicroTec Falcon ACS 200 Coater Developer Cluster, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 200 SpinCEE | Falcon ACS 200 Coater Developer ClusterSUSS MicroTec |
|---|---|---|
| OEM | CEE | SUSS MicroTec |
| Category | Resist Processing | Resist Processing |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 200 | SUSS MicroTec Falcon |
| Cited variants | — |
|
| Specifications | ||
| Phase | 1 Phase[2] | — |
| Type | Spin Coater[2] | — |
| Model | 200[2] | Falcon ACS 200[5] |
| Make | CEE[2] | — |
| Wafer Sizes | 8 inch[2] | 4, 5, 6, 8 inch[4] |
| Configuration | 1 Phase[2] | Developer (4)[1] |
| Equipment type | Spin Coater[2] | Coater / Developer Cluster System[5] |
| Spin speed | 5000 rpm[3] | — |
| Substrate support | Flat substrates up to 200 mm or fragments[3] | — |
| Substrate thickness max | 12 mm[3] | — |
| Coating thickness | Uniform coating thickness up to 100 µm[3] | — |
| Configuration (Asset #142142) | — | Developer (4) 2000 Vintage[1] |
| Configuration (Asset #142141) | — | Coater (3) 2000 Vintage[4] |
| OEM | — | SUSS[1] |
| Category | — | Resist Processing[5] |
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