Comparison ledger
CEE 300 Bake Plate, YES PB12, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | PB12YES | |
|---|---|---|
| OEM | CEE | YES |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 300 Bake Plate | YES PB12 |
| Cited variants | ||
| Specifications | ||
| Wafer size | up to 300mm wafer[3] | up to 300mm wafers[2] |
| Software | Internal OS[3] | — |
| Voltage | 208V[3] | — |
| Max Substrate Size | 300mm round or 12" x 12" square[1] | — |
| Min Substrate Size | 4 inch round[1] | — |
| Max Temperature | 300°C (400°C optional)[1] | — |
| Temperature Resolution | 0.1°C[1] | — |
| Temperature Uniformity | ±0.3% across working area[1] | — |
| Smart Pin Height Range | 0-19 mm[1] | — |
| Weight (machine only) | 146 lb (66.2 kg)[4] | — |
| Dimensions | 18" H x 18.75" W x 26.25" D[4] | — |
| Power | 3100-4100 watts[4] | — |
| Exhaust Port | 2" (50.8mm) OD[4] | — |
| Vacuum | 2" (50.8mm) OD[6] | high vacuum (10^-5)[2] |
| Temperature range | ambient to 300°C (400°C optional)[7] | — |
| Bake methods | contact, vacuum and proximity[7] | — |
| Smart Pin height range | 0 to 19 mm, programmed in 0.1 mm increments[7] | — |
| Weight | 146 lb (66.2 kg) excluding accessories[7] | — |
| Nitrogen for proximity baking | 35 psi (241 kPa)[7] | — |
| Exhaust | 2" OD[7] | — |
| Series | — | PB-HV Series (manual load)[2] |
| Model designation | — | PB12 High Vac Specs[2] |
| Maximum temperature | — | up to 450°C[2] |
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