Comparison ledger
DEK 288 and DEK 2Di, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 288DEK | 2DiDEK |
|---|---|---|
| OEM | DEK | DEK |
| Category | Assembly / SMT | Assembly / SMT |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | DEK 288 | DEK 2Di |
| Specifications | ||
| Minimum board size | 50 x 38 mm (2 x 1.5 in.)[1] | — |
| Maximum board size | 510 x 510 mm (20 x 20 in.)[1] | — |
| Thickness range | 0.4 to 6.4 mm (0.016 to 2.5 in.)[1] | — |
| Transport speed | 500 mm/second (19.5 in./second)[1] | — |
| Alignment repeatability | 25 µm repeatability at 6 Sigma[1] | — |
| Alignment accuracy | 25 µm print to pad at 3 Sigma[1] | — |
| Cycle time | 5 seconds + process variables, including fiducial capture and alignment[1] | — |
| Set-up time | Less than 5 minutes[1] | — |
| Product changeover | 2 minutes (approx.)[1] | — |
| Host communications | GEM and SECS II[1] | — |
| Networking | Windows-compatible LAN card[1] | — |
| Remote diagnostics | Modem option[1] | — |
| SPC | On board, serial, remote[1] | — |
| Approvals | CE, EC certificate of conformity (Safety and EMC), GS German trade union safety standard[1] | — |
| Approximate weight | 1500 kg[1] | — |
| Approximate dimensions | 1580 mm W x 1640 mm D x 1680 mm H (nominal)[1] | — |
| Stencil frame compatibility | External dimensions between 550 mm sq. and 850 mm sq.[1] | — |
| Screen adjustment X/Y range | ±10 mm, resolution 2.5 µm[1] | — |
| Theta range | ±2.0°, resolution 0.001°[1] | — |
| Printable area with clamps | 510 x 504 mm (20 x 19.8 in.)[1] | — |
| Printable area with snuggers | 510 x 510 mm (20 x 20 in.)[1] | — |
| Print stroke | 56 to 680 mm (2.2 to 28.8 in.)[1] | — |
| Print speed | 2 to 300 mm/second (0.08 to 12 in./second)[1] | — |
| Print pressure | 0.4 to 20 kg (1 to 44 lbs.) active during print[1] | — |
| Print gap | 0 to 3.0 mm (0 to 0.1 in.)[1] | — |
| PCB stencil separation speed | 0.1 to 20 mm/second (0.004 to 0.8 in./second)[1] | — |
| Print modes | Print/flood double squeegee[1] | — |
| Squeegee types | Accepts most materials and style blades[1] | — |
| Paste system | Option to dispense, 1 kg and 500 g cartridge[1] | — |
| Paste knead | Programmable paste kneading action[1] | — |
| Stencil cleaning | Programmable frequency and wipe combinations; dry, wet, vacuum options[1] | — |
| Air service | 3.5-6 bar[1] | — |
| Electrics | 110 V 32 amps, 220 V 16 amps[1] | — |
| Temperature cooling unit | Cools printhead temperature within the range 17-30°C[1] | — |
| Environmental control unit | Full temperature and humidity control of printhead environment[1] | — |
| Product bar-code reader | Dual Image identified board and product verification[1] | — |
| Screen bar-code reader | Product screen verification[1] | — |
| On-board SPC software | Windows-based software package displaying fiducial offsets, board stretch, front and rear squeegee pressure, print speed, separation speed, temperature and relative humidity; switchable between MMI and QC CALC[1] | — |
| Fiducial size | 0.5 to 3 mm (0.02 to 0.1 in.)[1] | — |
| Fiducial method | 2 and 3 fiducial option[1] | — |
| Align calibration | Fully automatic calibration[1] | — |
| Camera system | On-the-move telecentric XY camera with simultaneous look at stencil and board[1] | — |
| Stencil inspection | Blocked apertures and smearing on underside of stencil triggers under-stencil cleaner[1] | — |
| Board inspection | Paste alignment to pad, bridging, paste area, triggers paste dispense[1] | — |
| Board size (min/max) | 50 x 38 mm (2 x 1.5 in.) up to 510 x 510 mm (20 x 20 in.)[1] | — |
| Board thickness range | 0.4 to 6.4 mm (0.016 to 2.5 in.)[1] | — |
| Cycle time (incl. fiducial capture & alignment) | 5 seconds + process variables[1] | — |
| Print speed range | 2 to 300 mm/second (0.08 to 12 in./second)[1] | — |
| Print pressure range | 0.4 to 20 kg (1 to 44 lbs.) active during print[1] | — |
| Stencil frame size compatibility | frames with external dimensions between 550 mm (21.6 in.) sq. and 850 mm (31.5 in.) sq.[1] | — |
| Weight (approximate) | 1500 kg[1] | — |
| Dimensions (W x D x H) | 1580 mm W x 1640 mm D x 1680 mm H (nominal)[1] | — |
| Air supply | 3.5-6 bar[1] | — |
| Vision system type | On-the-move telecentric XY camera with simultaneous look at stencil and board[1] | — |
| inspection type | — | built-in 2-dimensional inspection system[2] |
| stencil inspection | — | detects blocked apertures and underside smearing[2] |
| board inspection | — | verifies correct paste location, alignment, and bridge detection[2] |
| camera system | — | coaxial look-up/look-down camera system[2] |
| lighting | — | advanced lighting with flat lighting, direct and indirect light, and an illuminated annular ring[2] |
| optics | — | telecentric lenses[2] |
| repeatability | — | 3-sigma repeatability[2] |
| board inspection repeatability | — | better than 5% 3-sigma repeatability in tests carried out by DEK[2] |
| processing time | — | 0.2 s per site[2] |
| inspection mode | — | OnePre mode captures a single pre-image of the first board for subsequent paste measurement cycles[2] |
| automation | — | selectable-mode automatic stencil cleaning cycle and alert mode[2] |
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