Comparison ledger
Denton Vacuum 635 and Denton Vacuum SJ20C, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 635Denton Vacuum | SJ20CDenton Vacuum |
|---|---|---|
| OEM | Denton Vacuum | Denton Vacuum |
| Category | Deposition | Deposition |
| Wafer size | 8" | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Denton Vacuum 635 | Denton Vacuum SJ20C |
| Specifications | ||
| OEM | Denton Vacuum[1] | — |
| Model | 635[1] | — |
| Tool type | Deposition[2] | — |
| Process capabilities | Four confocal cathodes, inclined 25 degrees off vertical[1] | — |
| Standard targets | 4" Au, 4" Cr, 3" Pt, 3" Ti[1] | — |
| Film thickness range | From a few nm to hundreds of nm[1] | — |
| Sputter power supplies | DC1 pulse or DC, DC2, RF1[1] | — |
| Cathode switching | Switch-control any supply to any cathode[1] | — |
| Co-sputter capability | Yes[1] | — |
| Substrate pre-clean | RF2 supply[1] | — |
| Reactive sputtering | Nitrogen or oxygen[1] | — |
| Stage diameter | 8 inch[1] | — |
| Substrate rotation | +/- 5% uniformity[1] | — |
| Chamber base pressure | 2 x 10^-7 Torr in 12 hours[1] | — |
| Substrate heating | Up to 500 C[1] | — |
| Liftoff deposition | With water-cooled stage[1] | — |
| Argon pressure range | < 1-90 mT[1] | — |
| APC / MFC controller | 100 sccm MFC controller[1] | — |
| Tool owner | — | Jim Pierce[3] |
| Serial number | — | 18097[3] |
| Description | — | Film thickness monitor/deposition controller[3] |
| Deposition method | — | E-beam evaporation[3] |
| Source hearths | — | 4 source hearth[3] |
| Evaporation materials available | — | Al, Ag, Au, Au/Ge, Cr, Cu, Ge, Mo, NiCr, Nb, Ni, Ta, Ti, W[3] |
| Crucible liner types | — | Poco Graphite crucible liners (large & small); Cu crucible liners[3] |
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