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Comparison ledger

635 versus SJ20C/Material

Denton Vacuum 635 and Denton Vacuum SJ20C/Material, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
635Denton Vacuum
SJ20C/MaterialDenton Vacuum
OEMDenton VacuumDenton Vacuum
CategoryDepositionDeposition
Wafer size8"
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyDenton Vacuum 635Denton Vacuum SJ20C/Material
Specifications
OEMDenton Vacuum[1]
Model635[1]
Tool typeDeposition[2]
Process capabilitiesFour confocal cathodes, inclined 25 degrees off vertical[1]
Standard targets4" Au, 4" Cr, 3" Pt, 3" Ti[1]
Film thickness rangeFrom a few nm to hundreds of nm[1]
Sputter power suppliesDC1 pulse or DC, DC2, RF1[1]
Cathode switchingSwitch-control any supply to any cathode[1]
Co-sputter capabilityYes[1]
Substrate pre-cleanRF2 supply[1]
Reactive sputteringNitrogen or oxygen[1]
Stage diameter8 inch[1]
Substrate rotation+/- 5% uniformity[1]
Chamber base pressure2 x 10^-7 Torr in 12 hours[1]
Substrate heatingUp to 500 C[1]
Liftoff depositionWith water-cooled stage[1]
Argon pressure range< 1-90 mT[1]
APC / MFC controller100 sccm MFC controller[1]
Tool ownerJim Pierce[3]
Serial number18097[3]
Tool descriptionFilm thickness monitor/deposition controller[3]
ProcessE-beam evaporation[3]
Evaporation materials availableAl, Ag, Au, Au/Ge, Cr, Cu, Ge, Mo, NiCr, Nb, Ni, Ta, Ti, W[3]
Crucible linersPoco Graphite crucible liners (large and small); Cu crucible liners[3]
SOPDenton SJ20C SOP[3]
Process TypeE-beam evaporation[3]
Deposition MethodPhysical Vapor Deposition (PVD)[3]
Number of Source Hearth Positions4[3]
Film Thickness Monitor/Deposition ControllerPresent[3]
Crucible Liner TypesPoco Graphite (large & small), Cu[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]nanofab.utah.edunanofab.utah.edu
  3. [3]nanofab.utah.edunanofab.utah.edu