Comparison ledger
Denton Vacuum Discovery 18 and Denton Vacuum Explorer 14, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | Discovery 18Denton Vacuum | Explorer 14Denton Vacuum |
|---|---|---|
| OEM | Denton Vacuum | Denton Vacuum |
| Category | Deposition | Deposition |
| Wafer size | 6-inch diameter stage | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Denton Vacuum Discovery | Denton Vacuum Explorer 14 |
| Specifications | ||
| Deposition type | Sputter deposition of metals, alloys, and insulating thin films[1] | — |
| Film thickness range | From a few nm to hundreds of nm[1] | — |
| Cathodes | Three 3-inch diameter confocal cathodes[1] | — |
| RF power supplies | 2 RF power supplies[1] | — |
| DC power supply | Switchable DC power supply[1] | — |
| Co-sputter capability | Yes[1] | — |
| Reactive sputtering | Available with nitrogen or oxygen[1] | — |
| Stage diameter | 6-inch diameter stage[1] | — |
| Substrate rotation uniformity | +/- 10%[1] | — |
| Pump system | Cryo and turbo pumped[1] | — |
| Base pressure | 1 x 10^7 Torr[1] | — |
| Substrate heating | Up to 200 C[1] | — |
| Liftoff deposition | Available with sputter power[1] | — |
| Argon pressure range | 3-15 mT controllable with 200 sccm MFC controller[1] | — |
| Chamber | — | 14"x 14"[2] |
| Configuration | — | 2 RF Cathodes, RF Plasma Clean[2] |
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