Comparison ledger
Despatch AST-1100, SUSS MicroTec ACS 300 Gen 2, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | AST-1100Despatch | ACS 300 Gen 2SUSS MicroTec |
|---|---|---|
| OEM | Despatch | SUSS MicroTec |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Despatch AST-1100 | SUSS MicroTec ACS 300 |
| Specifications | ||
| Wafer size | Designed for 300 mm silicon wafers; also suitable for 200 mm wafers[1] | System tooling for 200/300 mm semi spec wafer sizes[2] |
| Tool type | Automated photowhite bake tool[1] | — |
| Tool capacity | 50 wafers with standard two-chamber configuration[1] | — |
| Temperature uniformity | +/-1.0 °C between wafers and across all 25 wafers in the chamber at dunk temperature[1] | — |
| Maximum temperature | 175 °C[1] | — |
| Atmosphere | Inert atmosphere[1] | — |
| Cooling | Active cooling for rapid cool down[1] | — |
| Filtration | HEPA filter[1] | — |
| Dimensions | Approximately 262 cm wide and 224 cm long[1] | — |
| Automation features | Supports two front-opening unified pod (FOUP) load stations, a class 1 cleanroom-compatible robot, and an optically based class 1 laser cassette imaging sensor[1] | — |
| Compliance | Meets SEMI S2/S8 and SEMATECH appendices A, B, and C[1] | — |
| Communication standards | Meets 300 mm SEMI communications standards[1] | — |
| Options | FOUP ID reader, 2-level monitoring, wafer ID reader, uninterruptible power supply (UPS)[1] | — |
| Configuration | — | Includes:[2] |
| OEM | — | SUSS MicroTec[3] |
| Model | — | ACS 300 Gen 2[4] |
| Equipment type | — | Coater / Developer[2] |
| Automation | — | fully automatic[3] |
| Architecture | — | modular[3] |
| Process modes | — | spin-coating and spray-coating[3] |
| Integrated functions | — | coat, bake, and develop modules[2] |
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