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Comparison ledger

DAD 3220 Automatic Dicing versus DFL 7560 L

Disco DAD 3220 Automatic Dicing and Disco DFL 7560 L, side by side. Every value shown is drawn from its cited encyclopedia entry.

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Side-by-side comparison of selected equipment models
Attribute
DAD 3220 Automatic DicingDisco
DFL 7560 LDisco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size—Robot Wafer handling
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DADDisco DFL
Cited variants—
  • 200mm Fully Automatic wafer handling from/to standard wafer cassette[1]
Specifications
Spindle1.5 kw[2]—
Objective lens7.5 x[2]—
Configuration1000 Watt Spindle[3]Operation by touch panel LCD monitor[1]
Wafer size—Robot Wafer handling[1]
Wafer—Can be modified at later date to 3”, 4” & 6” wafers and frame[1]
Uninterruptible Power Supply—1[1]
DAD 3220 Automatic Dicing entryDFL 7560 L entry

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Sources (5)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]inventory listing