Comparison ledger
Disco DAD 3220 Automatic Dicing and Disco Z09, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | Z09Disco | |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | up to Φ8” workpieces |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DAD | Disco Z09 |
| Specifications | ||
| Spindle | 1.5 kw[1] | — |
| Objective lens | 7.5 x[1] | — |
| Configuration | 1000 Watt Spindle[2] | — |
| Model | — | DAD3241[5] |
| Max. workpiece size | — | Φ8”[5] |
| X-/Y-axis cutting range | — | 210 mm[5] |
| Cutting speed | — | 0.1-800 mm/s[5] |
| Index positioning accuracy | — | 0.002/210 mm[5] |
| Z-axis max. stroke | — | 32.2 mm[5] |
| Moving resolution | — | 0.000002 mm[5] |
| Repeatability accuracy | — | 0.001 mm[5] |
| Θ-axis max. rotating angle | — | 320°[5] |
| Rotation speed range | — | 6,000-60,000 rpm[5] |
| Spindle power | — | 1.8 kW[5] |
| Control interface | — | PC and touch screen via a specialized interface system[5] |
| Built-in microscope | — | Yes[5] |
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