Comparison ledger
Disco DAD 3230 Automatic Dicing, Disco DAD3220, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DAD3220Disco | |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DAD | Disco DAD3220 |
| Specifications | ||
| Phase | 3 Phase[1] | — |
| Configuration | 50/60 Hz[1] | — |
| Voltage | 200V[1] | — |
| OEM | Disco[1] | Disco[5] |
| Category | Dicing & Grinding[2] | — |
| Wafer size | 150 mm (Φ150 mm)[3] | — |
| Spindle power | 1.5 kW[4] | — |
| Objective lens | 7.5x[4] | — |
| Automatic functions | Auto-alignment, auto-focus, auto-kerf check[2] | — |
| Spindle lock | Shaft lock function for easier blade changing[2] | Shaft lock function for easier blade changing[6] |
| Model | — | DAD3220[5] |
| Code | — | SAW3[5] |
| Location | — | Sample Prep Room[5] |
| Max workpiece size | — | φ6 inch / 150×150 mm (user-specified specification)[6] |
| X-axis cutting range | — | 160 mm[6] |
| Cutting speed | — | 0.1 - 500 mm/s[6] |
| Y-axis cutting range | — | 162 mm[6] |
| Y-axis index step | — | 0.0001 mm[6] |
| Y-axis positioning accuracy | — | 0.005/160 mm (single error), 0.003/5 mm[6] |
| Z-axis max stroke | — | 32.2 mm (with φ2 inch blades)[6] |
| Z-axis moving resolution | — | 0.00005 mm[6] |
| Z-axis repeatability accuracy | — | 0.001 mm[6] |
| θ-axis max rotating angle | — | 320 deg[6] |
| Spindle rated output | — | 1.5 kW[6] |
| Spindle rated torque | — | 0.48 N·m[6] |
| Spindle rotation speed range | — | 3,000 - 40,000 min⁻¹[6] |
| Equipment dimensions (W × D × H) | — | 500 × 900 × 1,670 mm[6] |
| Equipment weight | — | Approx. 550 kg[6] |
| Display | — | LCD touch panel with graphical user interface[6] |
| Standard functions | — | Auto-alignment, auto-focus, auto-kerf check[6] |
| Type | — | Automatic dicing saw[6] |
| Workpiece size | — | 6-inch / 150 × 150 mm workpieces[6] |
| Workpiece note | — | Special specification for 6-inch square workpieces[6] |
| Spindle count | — | Single spindle[6] |
| Equipment width | — | 500 mm[6] |
| Equipment dimensions | — | 500 × 900 × 1,670 mm[6] |
| Functions | — | Auto-alignment, auto-focus, and auto-kerf check[6] |
| Single spindle | — | Yes[6] |
| Index step | — | 0.0001 mm[6] |
| Index positioning accuracy | — | 0.005/160 mm (single error); 0.003/5 mm[6] |
| Z-axis max. stroke | — | 32.2 mm (Φ2 inch blades)[6] |
| Rotation speed range | — | 3,000 - 40,000 min⁻1[6] |
| Application | — | Programmed dicing of silicon and other substrates[7] |
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