Waferpedia

Comparison ledger

DAD 3350 Automatic Dicing versus DGP 8760 + DFM 2800

Disco DAD 3350 Automatic Dicing and Disco DGP 8760 + DFM 2800, side by side. Every value shown is drawn from its cited encyclopedia entry.

LinkedIn X Email
Side-by-side comparison of selected equipment models
Attribute
DAD 3350 Automatic DicingDisco
DGP 8760 + DFM 2800Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DADDisco DGP 8760
Specifications
Maximum PowerAC 200 V[1]—
Configuration50/60 Hz[1]Fully automatic[6]
Phase3 Phase[1]—
Power4.9 kVA[1]—
Voltage200 VAC[4]—
DAD 3350 Automatic Dicing entryDGP 8760 + DFM 2800 entry

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]inventory listing