DAD 3350 Automatic Dicing

Machines in the dicing and grinding class are precision tools used to cut or thin fragile workpieces such as semiconductor wafers, compound semiconductor substrates, and other brittle engineered materials. They are designed to handle delicate materials without excessive chipping, cracking, or edge damage.

A dicing machine performs controlled separation of a processed substrate into individual dies, chips, or pieces, while grinding equipment in the same broader class is used to remove material and adjust thickness or surface condition before or after singulation depending on the process sequence.

Dicing systems typically secure the workpiece on a support surface and use a precision cutting mechanism to follow predefined separation lines. The machine coordinates motion, cutting action, and workpiece handling so the material is divided along narrow paths with controlled edge quality.

Grinding systems in this class use abrasive action to remove material in a managed way. The process relies on controlled contact between the workpiece and a rotating or moving abrasive element, with coolant or other process control methods often used to reduce heat, debris, and mechanical stress.

This class of equipment is usually placed after wafer processing steps that define device structures and before assembly or packaging. It supports downstream separation, die handling, or thickness preparation depending on whether the machine is used for dicing, grinding, or both.

Such machines are used in semiconductor manufacturing, compound semiconductor processing, MEMS work, optical component fabrication, and other precision substrate applications where brittle material must be separated or thinned with high positional control.