Comparison ledger
Disco DAD321 and Disco DAD641, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | DAD321Disco | DAD641Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | 100mm | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DAD321 | Disco DAD641 |
| Specifications | ||
| Machine type | Automatic dicing saw[1] | — |
| Wafer size | 100 mm, 150 mm[1] | — |
| Supported wafer materials | Silicon, glass and pyrex wafers[1] | — |
| Other materials | Other materials on demand[1] | — |
| Maximum thickness on silicon | 1 mm[1] | — |
| Maximum thickness on glass and pyrex | 2.4 mm[1] | — |
| Max wafer size | 6 inches[2] | — |
| Wafer type | All shapes and sizes[2] | — |
| Max wafer thickness | 2 mm[2] | — |
| Max blade speed | 30,000 rpm[2] | — |
| Max feed speed | 2 mm/sec[2] | — |
| Tape thickness | 70 μm[2] | — |
| Tool type | — | Dicing saw[3] |
| Location | — | Backend Lab[3] |
| Tool name | — | Disco DAD641[4] |
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