Waferpedia

Comparison ledger

DAD321 versus DFL 7361

Disco DAD321 and Disco DFL 7361, side by side. Every value shown is drawn from its cited encyclopedia entry.

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Side-by-side comparison of selected equipment models
Attribute
DAD321Disco
DFL 7361Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size100mmIntegrated Wafer Cleaning System with Atomizing Nozzle
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DAD321Disco DFL
Cited variants—
  • SECS/GEM Software[1]
  • Intemal lighting[1]
  • Virus-free PC[1]
  • STM DFL7161 2021 SW unified[1]
  • Barcode reading function for auto recipe loading[1]
  • Compatibility with Hogomax 5L tanks[1]
  • Change of Laser Focus Position for Maintenance[1]
  • Additional Kerf check sequence[1]
  • Password Modification up to Level 4[1]
  • Disco CO2 Injector + Integration specs[1]
  • CO2 injector (stand-alone) added[1]
  • Addition of drain valve for CO 2 injector specific resistance value stabilization[1]
  • CO2 water target resistivity value Settable in device data[1]
  • CO2 bubbler support (RS232C)[1]
  • New version Zxis assembly for DFL7161 with higher rigidity specs (standard for STM)[1]
Specifications
Machine typeAutomatic dicing saw[2]—
Wafer size100 mm, 150 mm[2]Integrated Wafer Cleaning System with Atomizing Nozzle[1]
Supported wafer materialsSilicon, glass and pyrex wafers[2]—
Other materialsOther materials on demand[2]—
Maximum thickness on silicon1 mm[2]—
Maximum thickness on glass and pyrex2.4 mm[2]—
Max wafer size6 inches[3]—
Wafer typeAll shapes and sizes[3]—
Max wafer thickness2 mm[3]—
Max blade speed30,000 rpm[3]—
Max feed speed2 mm/sec[3]—
Tape thickness70 μm[3]—
Configuration—Type FX Laser Head[1]
DAD321 entryDFL 7361 entry

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Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]epfl.chepfl.ch
  3. [3]ncf.uic.eduncf.uic.edu