Comparison ledger
Disco DAD321 and Disco Z09, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | DAD321Disco | Z09Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | 100mm | up to Φ8” workpieces |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DAD321 | Disco Z09 |
| Specifications | ||
| Machine type | Automatic dicing saw[1] | — |
| Wafer size | 100 mm, 150 mm[1] | — |
| Supported wafer materials | Silicon, glass and pyrex wafers[1] | — |
| Other materials | Other materials on demand[1] | — |
| Maximum thickness on silicon | 1 mm[1] | — |
| Maximum thickness on glass and pyrex | 2.4 mm[1] | — |
| Max wafer size | 6 inches[2] | — |
| Wafer type | All shapes and sizes[2] | — |
| Max wafer thickness | 2 mm[2] | — |
| Max blade speed | 30,000 rpm[2] | — |
| Max feed speed | 2 mm/sec[2] | — |
| Tape thickness | 70 μm[2] | — |
| Model | — | DAD3241[3] |
| Max. workpiece size | — | Φ8”[3] |
| X-/Y-axis cutting range | — | 210 mm[3] |
| Cutting speed | — | 0.1-800 mm/s[3] |
| Index positioning accuracy | — | 0.002/210 mm[3] |
| Z-axis max. stroke | — | 32.2 mm[3] |
| Moving resolution | — | 0.000002 mm[3] |
| Repeatability accuracy | — | 0.001 mm[3] |
| Θ-axis max. rotating angle | — | 320°[3] |
| Rotation speed range | — | 6,000-60,000 rpm[3] |
| Spindle power | — | 1.8 kW[3] |
| Control interface | — | PC and touch screen via a specialized interface system[3] |
| Built-in microscope | — | Yes[3] |
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