Waferpedia

Comparison ledger

DAD3220 versus DAD641

Disco DAD3220 and Disco DAD641, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
DAD3220Disco
DAD641Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyDisco DAD3220Disco DAD641
Specifications
OEMDisco[1]
ModelDAD3220[1]
CodeSAW3[1]
LocationSample Prep Room[1]Backend Lab[2]
Tool typeDicing saw[2]
Tool nameDisco DAD641[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]smif.pratt.duke.edusmif.pratt.duke.edu
  2. [2]nanofab.utah.edunanofab.utah.edu
  3. [3]nanofab.utah.edunanofab.utah.edu