Comparison ledger
Disco DAD3220 and Disco DFL 7560 L, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | DAD3220Disco | DFL 7560 LDisco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | Robot Wafer handling |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DAD3220 | Disco DFL |
| Cited variants | — |
|
| Specifications | ||
| OEM | Disco[2] | — |
| Model | DAD3220[2] | — |
| Code | SAW3[2] | — |
| Location | Sample Prep Room[2] | — |
| Wafer size | — | Robot Wafer handling[1] |
| Wafer | — | Can be modified at later date to 3”, 4” & 6” wafers and frame[1] |
| Configuration | — | Operation by touch panel LCD monitor[1] |
| Uninterruptible Power Supply | — | 1[1] |
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